Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same
View Patent ↗The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), R 1 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydroxymethyl group, R 2 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydrogen atom.) (In formula (2), R 3 represents an organic group having 1 or more carbon atoms, and R 4 to R 6 represent hydrogen atoms, methyl groups or ethyl groups.)
1. An epoxy resin composition, comprising:
a component (A);
a component (B); and
a component (C),
wherein:
the component (A) is an epoxy resin that does not include a sulfur atom in the molecule;
the component (B) is an imidazole compound represented by formula (1):
the component (C) is an imidazole compound represented by formula (2):
R 1 represents a straight-chain or branched-chain alkyl group or hydroxymethyl group having 1˜5 carbon atoms;
R 2 represents a hydrogen atom or a straight-chain or branched-chain alkyl group having 1˜5 carbon atoms;
R 3 represents an organic group comprising at least one carbon atom; and
R 4 ˜R 6 independently represent a hydrogen atom, a methyl group or an ethyl group, wherein
an amount of the component (C) is 1 to 6 parts by mass based on 100 parts by mass of a total amount of the epoxy resin.
2. The epoxy resin composition according to claim 1 , wherein the amount of the component (B) is 2˜40 parts by mass based on the total 100 parts by mass of a total amount of the epoxy resin.
3. The epoxy resin composition according to claim 1 , comprising the component (A), the component (B) and at least the component (C), wherein the component (C) is an imidazole compound encapsulated in microcapsules.
4. The epoxy resin composition according to claim 3 , wherein the component (C) encapsulated in the microcapsules is dispersed in an epoxy resin.
5. The epoxy resin composition according to claim 1 , further comprising a component (D) that is an epoxy resin comprising at least one sulfur atom in the molecule.
6. The epoxy resin composition according to claim 1 , wherein when a prepreg is formed by impregnating the epoxy resin composition into a reinforcing fiber bundle, such that when the prepreg is pressed for 5 minutes in a die preheated at 140° C. under a pressure of 1 MPa, the G′Tg of an obtained cured product is 150° C. or higher.
7. A prepreg formed by impregnating a reinforcing fiber bundle with the epoxy resin composition according to claim 1 .
8. A fiber-reinforced composite material obtained by curing the prepreg according to claim 7 .
9. A method for producing a fiber-reinforced composite material, the method comprising pressing the prepreg according to claim 7 for 1˜20 minutes in a die under a temperature of 100˜150° C. and a pressure of 1˜15 MPa.