IP Library Granted Patent US 9,926,647
Granted Patent B2
US 9,926,647 · App. 14/351,817 · Granted Mar 27, 2018

Method for producing β-Ga

Inventors: Takekazu Masui (Tokyo, JP); Yu Yamaoka (Tokyo, JP)
Assignees: TAMURA CORPORATION; KOHA CO., LTD.
C30B25/186C30B29/16C30B33/02H01L21/0262H01L21/02414H01L21/02565
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Quick Facts
Patent No.
US 9,926,647
App. No.
14/351,817
Granted
Mar 27, 2018
Kind
B2
Abstract

Provided are: a method for producing a β-Ga 2 O 3 substrate of which changes in donor concentration in a reducing atmosphere or an inert gas atmosphere are suppressed; and a method for producing a crystal laminate structure that can epitaxially grow a high-quality crystal film having low variability of quality in a reducing atmosphere or an inert gas atmosphere. The method for producing a β-Ga 2 O 3 substrate includes a step for cutting out a β-Ga 2 O 3 substrate from a β-Ga 2 O 3 crystal containing a group IV element; annealing processing in an atmosphere containing a reducing atmosphere and/or an inert gas atmosphere is performed on the β-Ga 2 O 3 crystal before cutting out the β-Ga 2 O 3 substrate, or on the cut-out β-Ga 2 O 3 substrate.

Claims (19)

1. A method for producing β-Ga 2 O 3 based substrate, the method comprising cutting out the β-Ga 2 O 3 based substrate from a β-Ga 2 O 3 based crystal containing a group IV element,

wherein an annealing processing in an inert gas atmosphere which does not comprise H 2 is performed on the β-Ga 2 O 3 based crystal before cutting out the β-Ga 2 O 3 based substrate or on the β-Ga 2 O 3 based substrate at a temperature of 1,000° C. to 1,725° C. to increase a donor concentration of the β-Ga 2 O 3 based crystal or the β-Ga 2 O 3 based substrate which is thereby made approximate to a concentration of the group IV element of the β-Ga 2 O 3 based crystal or the β-Ga 2 O 3 based substrate, and

wherein the annealing processing is performed for suppressing a change of the donor concentration of the β-Ga 2 O 3 based substrate to suppress a change of substrate temperature, when the β-Ga 2 O 3 based substrate is placed in a reduction atmosphere or the inert gas atmosphere after the annealing processing.

2. The method for producing a β-Ga 2 O 3 based substrate according to claim 1 , wherein the inert gas atmosphere comprises at least one of a N 2 atmosphere, an Ar atmosphere, a Ne atmosphere, and a He atmosphere.

3. The method for producing a β-Ga 2 O 3 based substrate according to claim 1 , wherein the group IV element comprises Si.

4. A method for producing a crystal laminate structure, the method comprising:

cutting out β-Ga 2 O 3 based substrate from a β-Ga 2 O 3 based crystal containing a group IV element; and

epitaxially growing a crystal film on the β-Ga 2 O 3 based substrate in a first atmosphere comprising at least one of a first reduction atmosphere and a first inert gas atmosphere,

wherein an annealing processing in a second inert gas atmosphere which does not comprise H 2 is performed on the β-Ga 2 O 3 based crystal before cutting out the β-Ga 2 O 3 based substrate at a temperature of 1,000° C. to 1,725° C. to increase a donor concentration of the β-Ga 2 O 3 based crystal or the β-Ga 2 O 3 based substrate which is thereby made approximate to a concentration of the group IV element of the β-Ga 2 O 3 based crystal or the β-Ga 2 O 3 based substrate, or on the β-Ga 2 O 3 based substrate before epitaxially growing the crystal film, and

wherein the annealing processing is performed for suppressing a change of the donor concentration of the β-Ga 2 O 3 based substrate to suppress a change of substrate temperature and a separation of the crystal film from the β-Ga 2 O 3 substrate, when the βGa 2 O 3 based substrate is placed in the first reduction atmosphere or the first inert gas atmosphere after the annealing processing.

5. The method for producing a crystal laminate structure according to claim 4 , wherein the first and second atmospheres comprise at least one of a N 2 atmosphere, an Ar atmosphere, a Ne atmosphere and a He atmosphere.

6. The method for producing a crystal laminate structure according to claim 4 , wherein the group IV element comprises Si.

7. The method for producing β-Ga 2 O 3 based substrate according to claim 1 , wherein the β-Ga 2 O 3 based crystal includes a β-Ga 2 O 3 single crystal.

8. The method for producing a β-Ga 2 O 3 based substrate according to claim 7 , wherein Al or In is added to the β-Ga 2 O 3 single crystal.

9. The method for producing a β-Ga 2 O 3 based substrate according to claim 8 , wherein the β-Ga 2 O 3 based crystal includes Si as a dopant.

10. The method for producing a crystal laminate structure according to claim 4 , wherein the β-Ga 2 O 3 based crystal includes a β-Ga 2 O 3 single crystal.

11. The method for producing a crystal laminate structure according to claim 10 , wherein Al or In is added to the β-Ga 2 O 3 single crystal.

12. The method for producing a crystal laminate structure according to claim 11 , wherein the β-Ga 2 O 3 based crystal includes Si as a dopant.

13. The method for producing a β-Ga 2 O 3 based substrate according to claim 1 , wherein an entirety of the annealing processing is performed in the inert gas atmosphere.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2022
From: KOHA CO., LTD.
To: TAMURA CORPORATION
Reel/Frame 058547/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2014
From: MASUI, TAKEKAZU; YAMAOKA, YU
To: TAMURA CORPORATION; KOHA CO., LTD.
Reel/Frame 032803/0191 →
Priority Claims (1)
JP 2011-226554 · Oct 14, 2011 · national
Continuity (1)
Related Publication 20140230723A1 · Aug 21, 2014