SHIELDING STRUCTURE FOR ELECTRONIC DEVICE
The invention provides an electromagnetic shielding for electronic device. The electromagnetic shielding comprises: an opening provided at a position corresponding to the electronic device, through which a heat sink passes to be in contact directly with the electronic device; and at least one elastic arm made of conductive material provided at the circumference of the opening which are extending in a direction away from the shielding to be in a conductive contact with the side surface of the heat sink when the heat sink is mounted in position.
1 . An electromagnetic shielding for electronic device, comprising:
an opening provided at a position corresponding to the electronic device, through which a heat sink passes to be in contact directly with the electronic device; and
at least one elastic arm made of conductive material provided at the circumference of the opening, which are extending in a direction away from the shielding to be in a conductive contact with the side surface of the heat sink when the heat sink is mounted in position.
2 . The electromagnetic shielding for electronic device according to the claim 1 , wherein the shape and the dimension of the opening are substantially identical to the outline shape and the dimension of the cross section of the heat sink respectively, with the purpose of positioning the heat sink in the opening.
3 . The electromagnetic shielding for electronic device according to the claim 1 , wherein elastic arms are provided in pairs.
4 . The electromagnetic shielding for electronic device according to the claim 3 , wherein each pair of elastic arms are provided at symmetrical position of the circumference of the opening.
5 . The electromagnetic shielding for electronic device according to claim 1 , wherein the elastic arm is made of stainless steel.
6 . The electromagnetic shielding for electronic device according the claim 2 , wherein a guide chamfer or bending is provided on the elastic arm to facilitate the mounting of the heat sink through the opening.
7 . The electromagnetic shielding for electronic device according to claim 1 , wherein the heat sink is provided with a conductive coating.
8 . The electromagnetic shielding for electronic device according to the claim 7 , wherein the conductive coating is a conductive oxidation coating.
9 . The electromagnetic shielding for electronic device according to claim 1 , wherein both the shielding and the electronic device are mounted on a printed circuit board.
10 . An electronic device comprising a printed circuit board to which an electrical component is attached, an electromagnetic shielding according to one of the previous claims for shielding said component, wherein the opening is positioned over the component, and a heat sink placed on the component, wherein the heat sink is positioned in the opening.