Granted Patent B2

US 9,218,968 · App. 14/352,136 · Granted Dec 22, 2015

Abstract

Claims (23)

1. A method for forming a crystalline thin film, the method comprising:

preparing a substrate;

forming a thin film above the substrate; and

crystallizing at least a predetermined region in the thin film, by irradiating the thin film with a beam having a predetermined wavelength and scanned relative to the substrate,

wherein if (i) the substrate has an end portion intersecting with a first direction and an other end portion intersecting with a second direction which runs perpendicular to the first direction and (ii) the end portion and the other end portion warp toward a light source of the beam, a warpage amount of the end portion is compared with a warpage amount of the other end portion and one of the first direction and the second direction, whichever having a larger warpage amount of the warpage amounts, is identified as a direction of a largest residual stress on the substrate, and

in the crystallizing, the beam is scanned in the identified direction of the largest residual stress.

2. The method for forming the crystalline thin film according to claim 1 ,

wherein the beam is one of a YAG laser beam, a continuously oscillated laser beam, and a beam for heating a lamp.

3. The method for forming the crystalline thin film according to claim 1 ,

wherein the irradiating includes irradiating a whole surface of the thin film with the beam.

4. The method for forming the crystalline thin film according to claim 1 ,

wherein the substrate is rectangular, and

the direction of the largest residual stress is a longitudinal direction of the substrate.

5. The method for forming the crystalline thin film according to claim 1 ,

wherein the substrate is a glass substrate.

6. The method for forming the crystalline thin film according to claim 1 ,

wherein the substrate is a plastic substrate.

7. A method for manufacturing a thin-film transistor including forming a channel region of a bottom-gate thin-film transistor, using the method for forming the crystalline thin film according to claim 1 .

8. The method for forming the crystalline thin film according to claim 1 ,

wherein the substrate is manufactured by thermally processing a precursor of the substrate.

9. The method for forming the crystalline thin film according to claim 8 ,

wherein the substrate formed by stretching and cooling the precursor of the substrate, and

the direction of the largest residual stress is a direction in which the substrate is stretched.

Assignments (6)