Optoelectronic semiconductor chip and method for producing the latter

1. An optoelectronic semiconductor chip having a layer stack comprising:

a first semiconductor layer sequence comprising a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type and a first active zone being arranged between the first semiconductor region and the second semiconductor region, the first active zone being configured to generate a first electromagnetic radiation; and

a second semiconductor layer sequence comprising the second semiconductor region of the second conductivity type, a third semiconductor region of the first conductivity type and a second active zone being arranged between the second semiconductor region and the third semiconductor region, the second active zone being configured to generate a second electromagnetic radiation,

wherein the second semiconductor region is contacted through two first openings which are spaced apart from one another and extend from a surface of the first semiconductor region remote from the first active zone as far as into the second semiconductor region,

wherein a first electrical contact layer is arranged in the two first openings for forming two first through vias, and

wherein the first electrical contact layer covers the first semiconductor region so that the two first through vias are electrically connected to each other by the first electrical contact layer covering the first semiconductor region.

2. The semiconductor chip according to claim 1 , wherein no tunnel junction or bonding layers is arranged between the first semiconductor layer sequence and the second semiconductor layer sequence.

3. The semiconductor chip according to claim 1 , wherein the first electrical contact layer is electrically insulated from the first semiconductor region and from the first active zone and electrically contacts the second semiconductor region.

4. The semiconductor chip according to claim 3 , further comprising a second electrical contact layer arranged on the surface of the first semiconductor region remote from the first active zone, wherein the second electrical contact layer is insulated electrically from the first electrical contact layer and electrically contacts the first semiconductor region.

5. The semiconductor chip according to claim 4 , further comprising a third electrical contact layer arranged on a surface of the third semiconductor region remote from the second active zone, wherein the third electrical contact layer extends on a side face of the semiconductor chip—in an electrically insulated manner relative to the semiconductor chip—to the second electrical contact layer and electrically contacts the third semiconductor region.

6. The semiconductor chip according to claim 4 , further comprising a second opening that extends from the surface of the first semiconductor region remote from the first active zone as far as into the third semiconductor region.

7. The semiconductor chip according to claim 6 , wherein the second electrical contact layer is arranged in the second opening, and wherein the second electrical contact layer is electrically insulated from the first active zone, the second semiconductor region and the second active zone and electrically contacts the third semiconductor region.

8. The semiconductor chip according to claim 7 , wherein the second electrical contact layer is also arranged on a side of the first semiconductor region remote from the first active zone and contacts the first semiconductor region electrically.

9. The semiconductor chip according to claim 1 , further comprising a second electrical contact layer and a third electrical contact layer arranged on a side of the first semiconductor region remote from the first active zone, wherein the second electrical contact layer is electrically insulated from the first electrical contact layer and electrically contacts the third semiconductor region, and wherein the third electrical contact layer is electrically insulated from the first electrical contact layer and from the second electrical contact layer and electrically contacts the first semiconductor region.

10. The semiconductor chip according to claim 1 , wherein a current spreading layer is arranged on a side of the first semiconductor layer sequence remote from the second semiconductor layer sequence.

11. The semiconductor chip according to claim 1 , wherein a surface of the third semiconductor region remote from the second active zone comprises roughening and/or radiation outcoupling structures.

12. The semiconductor chip according to claim 1 , wherein the first electromagnetic radiation is different from the second electromagnetic radiation.

13. An optoelectronic semiconductor chip having a layer stack comprising:

a first semiconductor layer sequence comprising a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type and a first active zone being arranged between the first semiconductor region and the second semiconductor region, the first active zone being configured to generate a first electromagnetic radiation;

a second semiconductor layer sequence comprising the second semiconductor region of the second conductivity type, a third semiconductor region of the first conductivity type and a second active zone being arranged between the second semiconductor region and the third semiconductor region the second active zone being configured to generate a second electromagnetic radiation;

a plurality of first openings that are spaced apart from one another and that extend from a surface of the first semiconductor region remote from the first active zone to electrically contact the second semiconductor region;

a first electrical contact layer arranged in the first openings, wherein the first electrical contact layer covers a majority of the first semiconductor region such that material of the first electrical contact layer of one first opening is electrically connected to material of a another first opening; and

at least one second opening which extends from the surface of the first semiconductor region remote from the first active zone as far as into the third semiconductor region; and

a second electrical contact layer arranged on the surface of the first semiconductor region remote from the first active zone,

wherein the second electrical contact layer is electrically connected to the first semiconductor region,

wherein the second electrical contact layer extends into the second opening and thereby electrically contacting the third semiconductor region, and

wherein the second electrical contact layer comprises an opening in a region of one of the first openings such that the first electrical contact layer passes through that opening of the second electrical contact layer.

14. The optoelectronic semiconductor chip according to claim 13 , wherein the first electrical contact layer passes through the opening of the second electrical contact layer without electrically contacting the second electrical contact layer.

15. The optoelectronic semiconductor chip according to claim 13 , wherein the second semiconductor region comprises a superlattice structure.

16. The optoelectronic semiconductor chip according to claim 13 , wherein the second semiconductor region comprises an n-doped layer that has a doping profile that increases towards a middle of the n-doped layer such that the middle of the n-doped layer is highly doped.

17. The optoelectronic semiconductor chip according to claim 13 , wherein the second semiconductor region comprises a layer that contains a two-dimensional charge carrier gas.