Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition
View Patent ↗The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C. and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G′Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.
1. A prepreg, comprising:
a reinforcing fiber; and
an epoxy resin composition comprising a component (A), a component (B), a component (D), and a component (C) as an optional component,
wherein:
the component (A) is an epoxy resin that does not include a sulfur atom in the molecule:
the component (B) is an imidazole compound represented by formula (1):
R 1 represents a straight-chain or branched-chain alkyl group or hydroxymethyl group having 1-5 carbon atoms;
R 2 represents a hydrogen atom or a straight-chain or branched-chain alkyl group having 1-5 carbon atoms;
the component (C) is an imidazole compound represented by formula (2):
R 3 represents an organic group containing at least one carbon atom, and R 4 ˜R 6 represent a hydrogen atom, a methyl group or an ethyl group;
the component (D) is an epoxy resin that includes at least one sulfur atom in its molecule; and
an amount of the component (B) in the epoxy resin composition is 2˜40 parts by mass based on the total 100 parts by mass of the component (A) and the component (D),
provided that a curing agent other than the components (A) to (D) is not included in the epoxy resin composition.
2. The prepreg according to claim 1 , wherein the epoxy resin composition comprises the component (C).
3. The prepreg according to claim 2 , wherein the component (C) is an imidazole compound encapsulated in microcapsules.
4. The prepreg according to claim 2 , wherein a mass ratio of the component (A) to the component (D) in the epoxy resin composition is 95:5˜10:90.
5. The prepreg according to claim 4 , wherein the component (D) comprises a structure represented by formula (3):
6. The prepreg according to claim 5 , wherein the component (D) comprises a structure represented by formula (4):
7. The prepreg according to claim 6 , wherein the component (D) comprises a reaction product of the epoxy resin and an amine compound having at least one sulfur atom in its molecule.
8. The prepreg according to claim 4 , wherein the component (D) comprises a structure represented by formula (4):
9. A fiber-reinforced composite material obtained by a process comprising curing the prepreg according to claim 1 .
10. A method for producing a fiber-reinforced composite material, the method comprising:
pressing the prepreg according to claim 1 in a die for 1˜20 minutes under a temperature of 100˜150° C. and a pressure of 1˜15 MPa.
11. The prepreg according to claim 1 , wherein the prepreg in cured form has a glass transition temperature of 150° C. or higher when the prepreg is cured by being pressed for 5 minutes in a die preheated at 140° C. under a pressure of 1 MPa.