IP Library Granted Patent US 9,325,418
Granted Patent B2
US 9,325,418 · App. 14/354,759 · Granted Apr 26, 2016

Optical module with flexible wiring board

Inventors: Toshitaka Kuroda (Tokyo, JP); Satoru Yoshida (Tokyo, JP); Toshiyasu Ito (Tokyo, JP)
Assignee: MELLANOX TECHNOLOGIES, LTD.
H04B10/40G02B6/4201G02B6/4246G02B6/4281G02B6/4284
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Quick Facts
Patent No.
US 9,325,418
App. No.
14/354,759
Granted
Apr 26, 2016
Kind
B2
Abstract

On a predetermined mounting surface of a surface ( 22 A) of a flexible wiring board ( 22 ), a flexible wiring board pressing plate ( 28 ) which presses the mounting surface against a lower cover ( 12 ) is provided at a position immediately below a first radiation block ( 24 ) and a pressing sheet ( 26 ). The flexible wiring board pressing plate ( 28 ) has five pairs of projections ( 28 PA and 28 PB) respectively arranged in lines. The projections ( 28 PA and 28 PB) are formed to intersect conductive patterns ( 22 ACP) at predetermined intervals.

Claims (24)

1. An optical module comprising:

a flexible wiring board having a light-emitting element, a light-receiving element, and a semiconductor element to drive the light-emitting element and the light-receiving element mounted on one surface of the flexible wiring board;

a housing having a supporting surface to support the one surface of the flexible wiring board;

a pressing plate to come into contact with another surface of the flexible wiring board; and

an elastic member configured to bias the pressing plate toward the other surface of the flexible wiring board disposed on the supporting surface of the housing, wherein

the flexible wiring board is pinched by the pressing plate and the supporting surface of the housing, and the flexible wiring board has a conductive pattern formed on the other surface, and

the pressing plate has a projection to come into contact with the conductive pattern.

2. The optical module according to claim 1 , wherein the flexible wiring board has a conductive pattern formed on the one surface, and

the supporting surface of the housing has a recessed portion corresponding to another conductive pattern on the flexible wiring board.

3. The optical module according to claim 1 , wherein the housing is formed from a metallic material.

4. An optical module comprising:

a flexible wiring board having a light-emitting element, a light-receiving element, and a semiconductor element to drive the light-emitting element and the light-receiving element mounted on one surface of the flexible wiring board;

a housing having a supporting surface to support the one surface of the flexible wiring board;

a pressing plate to come into contact with another surface of the flexible wiring board; and

an elastic member configured to bias the pressing plate toward the other surface of the flexible wiring board disposed on the supporting surface of the housing, wherein

the flexible wiring board is pinched by the pressing plate and the supporting surface of the housing, the flexible wiring board has a conductive pattern formed on the other surface, and the pressing plate has a projection to come into contact with the conductive pattern, and

the projection of the pressing plate has an arc-shaped tip end portion to come into contact with the conductive pattern.

5. An optical module comprising:

a flexible wiring board having a light-emitting element, a light-receiving element, and a semiconductor element to drive the light-emitting element and the light-receiving element mounted on one surface of the flexible wiring board;

a housing having a supporting surface to support the one surface of the flexible wiring board;

a pressing plate to come into contact with another surface of the flexible wiring board; and

an elastic member configured to bias the pressing plate toward the other surface of the flexible wiring board disposed on the supporting surface of the housing, wherein

the flexible wiring board is pinched by the pressing plate and the supporting surface of the housing, and

the elastic member is pinched between a radiation member provided in an inner peripheral portion of a containing portion of the housing and the pressing member.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL AT REEL/FRAME NO. 37900/0720 Recorded Jul 13, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MELLANOX TECHNOLOGIES, LTD.
Reel/Frame 046542/0792 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2016
From: YAMAICHI ELECTRONICS CO., LTD.
To: MELLANOX TECHNOLOGIES, LTD.
Reel/Frame 038213/0193 →
PATENT SECURITY AGREEMENT Recorded Feb 24, 2016
From: MELLANOX TECHNOLOGIES, LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037900/0720 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2014
From: KURODA, TOSHITAKA; YOSHIDA, SATORU; ITO, TOSHIYASU
To: YAMAICHI ELECTRONICS CO., LTD.; MELLANOX TECHNOLOGIES, LTD.
Reel/Frame 032769/0932 →
Priority Claims (1)
JP 2011-238676 · Oct 31, 2011 · national
Continuity (1)
Related Publication 20140284463A1 · Sep 25, 2014