IP Library Granted Patent US 9,392,716
Granted Patent B2
US 9,392,716 · App. 14/355,258 · Granted Jul 12, 2016

Driver assembly and method for manufacturing the same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,392,716
App. No.
14/355,258
Granted
Jul 12, 2016
Kind
B2
Abstract

A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.

Claims (18)

1. A driver assembly, comprising:

a driver housing and

a driver, the driver comprising at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion,

wherein the driver housing comprises at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.

2. The driver assembly according to claim 1 , wherein the first portion is a first electronic module, and the second portion comprises a PCB board for mounting the first electronic module and at least one second electronic module mounted on the PCB board.

3. The driver assembly according to claim 2 , wherein the driver housing comprises a bottom for supporting the PCB board, the first cavity is defined by inner frame formed in one piece with the bottom, and the second cavity is the space in the driver housing other than the first cavity.

4. The driver assembly according to claim 3 , wherein the first cavity has a geometrical shape matched with the first electronic module.

5. The driver assembly according to claim 2 , wherein the first cavity merely accommodates the first electronic module.

6. The driver assembly according to claim 1 , wherein the first portion further comprises a heat conductor connected to an end surface of the first electronic module facing the first cavity, and the heat conductor and the first electronic module as a whole are at least partially accommodated in the first cavity.

7. The driver assembly according to claim 6 , wherein the heat conductor is fixed on the end surface via bonding, clipping or welding.

8. The driver assembly according to claim 7 , wherein the heat conductor is a heat conduction stick or a heat conduction flake.

9. The driver assembly according to claim 1 , wherein the first electronic module is an IC chip or an inductor.

10. The driver assembly according to claim 1 , wherein the potting material is a solidifiable liquid or gel.

11. A method for manufacturing a driver assembly, the method comprising:

providing a driver having at least one first portion and a second portion;

providing a driver housing, wherein the driver housing is formed with a first cavity for accommodating the at least one first portion of the driver and a second cavity for accommodating the second portion of the driver, wherein the first portion has a lower heat resistance than the second portion;

filling a potting material in the first cavity; and

mounting the driver in the driver housing, wherein the first portion is at least partially inserted into the first cavity corresponding thereto to encapsulate the first portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2020
From: OSRAM GMBH
To: LEDVANCE GMBH
Reel/Frame 053144/0291 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2014
From: WANG, MINGTAO; HE, GUOAN; WU, LIBO
To: OSRAM GMBH
Reel/Frame 033491/0918 →