LED module
The invention relates to a light-emitting diode arrangement having the following: a preferably heat-conductive substrate ( 2 ); a printed circuit board ( 5 ) which is arranged on the substrate ( 2 ), a recess ( 9 ) being provided in the printed circuit board ( 5 ); and at least one light-emitting diode chip ( 3 ) which is arranged on the substrate ( 2 ) and in the recess ( 9 ), said recess ( 9 ) being at least partly filled with at least one matrix material which preferably has a color-converting material ( 8 ).
1. A light-emitting diode (LED) arrangement, comprising:
a metallic, thermally conductive carrier ( 2 ),
a printed circuit board ( 5 ) arranged on the carrier ( 2 ), wherein a cutout ( 9 ) is provided in the printed circuit board ( 5 ),
at least one light-emitting diode chip ( 3 ) which is arranged on the carrier ( 2 ) and in the cutout ( 9 ) and is electrically contact-connected to the printed circuit board, wherein the printed circuit board ( 5 ) has a thickness (D) that is 2 to 3 times greater than a thickness of the light-emitting diode chip ( 3 ), and wherein the cutout ( 9 ) is completely filled with at least one matrix material comprising a color conversion material ( 8 ), a height (F) of the filled in color conversion material ( 8 ) corresponds to the thickness (D) of the printed circuit board ( 5 ).
2. The light-emitting diode arrangement as claimed in claim 1 , wherein an inner side ( 12 ) of the printed circuit board ( 5 ) which delimits the cutout ( 9 ) in said printed circuit board ( 5 ) is at least partly covered with the color conversion material ( 8 ).
3. The light-emitting diode arrangement as claimed in claim 1 , wherein the light-emitting diode arrangement comprises at least two light-emitting diode chips ( 3 ) which have different emission spectra, wherein said two LED chips are arranged in the same cutout or in different cutouts in the printed circuit board.
4. The light-emitting diode arrangement as claimed in claim 1 , wherein only light-emitting diode chips ( 3 ) which have a substantially identical emission spectrum are arranged in each cutout ( 9 ).
5. The light-emitting diode arrangement as claimed in claim 1 , wherein the printed circuit board ( 5 ) comprises at least two cutouts ( 9 ), wherein a thickness of the color conversion material ( 8 ) is individually adapted in each cutout ( 9 ).
6. The light-emitting diode arrangement as claimed in claim 1 , wherein the at least one of composition or the concentration of the color conversion material ( 8 ) is individually adapted in each cutout.
7. The light-emitting diode arrangement as claimed in claim 1 , wherein the mixed light resulting from the mixing of the light generated by each light-emitting diode chip ( 3 ) with phosphor conversion is a white light.
8. The light-emitting diode arrangement as claimed in claim 1 , wherein the light-emitting diode chip ( 3 ) is fixed on the carrier ( 2 ) by means of a chip adhesive or soldering.
9. The light-emitting diode arrangement as claimed in claim 1 , wherein, at least in the region of the cutout ( 9 ), the carrier ( 2 ) is coated reflectively or highly reflectively in the light emission direction.
10. The light-emitting diode arrangement as claimed in claim 1 , wherein an inner side ( 12 ) of the printed circuit board ( 5 ) which delimits the cutout ( 9 ) is coated reflectively or highly reflectively.
11. The light-emitting diode arrangement as claimed in claim 1 , wherein an inner side ( 12 ) of the printed circuit board ( 5 ) which delimits the cutout ( 9 ) is configured in a funnel-shaped fashion as viewed in the light emission direction, or wherein an area of the cutout ( 9 ) on a top side ( 10 ) of the printed circuit board ( 5 ) is greater than an area of the cutout ( 9 ) on an underside ( 11 ) of the printed circuit board ( 5 ).
12. The light-emitting diode arrangement as claimed in claim 1 , wherein a reflector ( 81 ), which is reflective and funnel-shaped in the light emission direction, is arranged on an inner side ( 12 ) of the printed circuit board ( 5 ) which defines the cutout ( 9 ).
13. The light-emitting diode arrangement as claimed in claim 1 , wherein a wall ( 41 ) is provided on the printed circuit board around the cutout in such a way that the color conversion material ( 8 ) can be filled in the cutout as far as the wall ( 41 ).
14. The light-emitting diode arrangement as claimed in claim 1 , wherein the carrier ( 2 ) has a depression ( 51 ) in a region of the cutout ( 9 ), the light-emitting diode chips ( 3 ) being arranged on said depression.
15. The light-emitting diode arrangement as claimed in claim 1 , wherein a lens is arranged on the color conversion material ( 8 ).
16. An LED lamp, comprising a light-emitting diode arrangement as claimed in claim 1 .
17. A light-emitting diode (LED) arrangement, comprising:
a metallic, thermally conductive carrier ( 2 ),
a printed circuit board ( 5 ) arranged on the carrier ( 2 ), wherein a cutout ( 9 ) is provided in the printed circuit board ( 5 ),
at least one light-emitting diode chip ( 3 ), which is arranged on the carrier ( 2 ) and in the cutout ( 9 ) and is electrically contact-connected, by a bonding wire ( 4 ), to a conductor track ( 6 ) of the printed circuit board, wherein the printed circuit board ( 5 ) has a thickness (D) that is 2 to 3 times greater than a thickness of the light-emitting diode chip ( 3 ), and wherein the cutout ( 9 ) is completely filled with at least one matrix material comprising a color conversion material ( 8 ) a height (F) of the filled in color conversion material ( 8 ) corresponds to the thickness (D) of the printed circuit board ( 5 ).