System and methods for processing a substrate
According to the present disclosure, a substrate processing apparatus for processing a flexible substrate including a vacuum chamber configured for being evacuated and being configured for having a process gas provided therein, a processing module adapted to process the flexible substrate, wherein the processing module is provided within the vacuum chamber, and a discharging assembly configured to generate a flow of charged particles to discharge the flexible substrate is provided. The discharging assembly is configured to generate an electric field for ionizing a processing gas.
1. A substrate processing apparatus for processing a flexible substrate, comprising:
a vacuum chamber configured for being evacuated and being configured for having a process gas provided therein;
a processing module adapted to process the flexible substrate, wherein the processing module is provided within the vacuum chamber;
a discharging assembly for connection to a power supply and configured to generate a flow of charged particles to discharge the flexible substrate within the vacuum chamber, wherein the discharging assembly is configured to generate an electrical field for ionizing the processing gas;
a charge detection means for detecting a charge on the flexible substrate within the vacuum chamber before discharging; and
a controller for connection to the power supply, wherein the controller is connected to the charge detection means and is adapted to control a polarity value and a voltage value of the power supply based on a charge detected by the charge detection means.
2. The substrate processing apparatus according to claim 1 , wherein the discharging assembly includes one or more spikes configured for being provided with a high voltage.
3. The substrate processing apparatus according to claim 2 , wherein the spikes are provided on one or more lances.
4. The substrate processing apparatus according to claim 2 , wherein the power supply is connectable to the one or more spikes.
5. The substrate processing apparatus according to claim 2 , wherein the one or more spikes are made of tungsten.
6. The substrate processing apparatus according to claim 3 , wherein at least one lance is positioned to face a first surface of the substrate.
7. The substrate processing apparatus according to claim 6 , wherein at least one other lance is positioned to face a second surface of the substrate that is opposite to the first surface of the substrate.
8. The substrate processing apparatus according to claim 1 , wherein the controller or the power supply are positioned outside of the vacuum chamber.
9. The substrate processing apparatus according to claim 1 , wherein the controller and the power supply are positioned outside of the vacuum chamber.