Heat sink mounting apparatus and method

1. A heat sink mounting apparatus comprising:

a heat sink, the heat sink comprising an elongate protrusion; and

a device housing, the device housing having a slot in a wall of the device housing configured to receive the heat sink,

wherein the heat sink and the device housing are configured to secure the heat sink within the slot with an interference fit,

wherein the elongate protrusion is configured to be received in a corresponding groove in the slot in the wall of the device housing, and

wherein the elongate protrusion comprises a hollow channel machined therein to facilitate a temporary distortion of the elongate protrusion during insertion of the heat sink within the slot in the wall of the device housing.

2. The heat sink mounting apparatus according to claim 1 , wherein the elongate protrusion comprises a curved surface.

3. The heat sink mounting apparatus according to claim 2 , wherein the elongate protrusion is dome-shaped in cross-section.

4. The heat sink mounting apparatus according to claim 1 , wherein the hollow channel comprises generally the same shape as the elongate protrusion.

5. The heat sink mounting apparatus according to claim 1 , wherein the elongate protrusion is capable of the temporary distortion under pressure.

6. The heat sink mounting apparatus according to claim 1 , wherein the heat sink is machined from a solid block.

7. The heat sink mounting apparatus according to claim 1 , wherein the heat sink is formed from aluminium alloy.

8. The heat sink mounting apparatus according to claim 1 , wherein a plurality of elongate protrusions comprise a respective hollow channel and are provided on the heat sink for engaging with a plurality of corresponding grooves in the slot in the wall of the device housing.

9. The heat sink mounting apparatus according to claim 1 , comprising a plurality of heat sinks for engaging with a plurality of slots in the wall of the device housing.

10. The heat sink mounting apparatus according to claim 1 , wherein the device housing is a housing of a subsea electronics module for a subsea control module of a control system for a subsea well.

11. A method of mounting a heat sink to a wall of a device housing, the device housing having a slot in the wall of the device housing configured to receive the heat sink, the heat sink and the device housing configured such that the heat sink can be secured within the slot with an interference fit, the method comprising the steps of:

aligning the heat sink with the slot in the wall of the device housing; and

applying a force to the heat sink in the direction of the slot such that at least a portion of the heat sink is received within the slot,

wherein the heat sink comprises an elongate protrusion, the elongate protrusion comprising a hollow channel machined therein to facilitate a temporary distortion of the elongate protrusion during insertion of the heat sink within the slot in the wall of the device housing,

wherein the elongate protrusion is configured to be received in a corresponding groove in the slot in the wall of the device housing, and

wherein the force applied is sufficient to cause the temporary distortion of the elongate protrusion.

12. The heat sink mounting apparatus according to claim 1 , wherein the elongate protrusion is machined on a side edge of the heat sink.

13. The method according to claim 11 , wherein the elongate protrusion is machined on a side edge of the heat sink.