Multilayer glass ceramic substrate with embedded resistor
A multilayer glass ceramic substrate includes a number of insulating layers composed of glass ceramics. An embedded resistor is formed between the insulating layers. The resistor includes scattered microvoids and includes materials containing conductive powders and glass powders. First and second internal conductors are provided where a first end of the embedded resistor is connected to the first internal conductor and a second end of the embedded resistor is connected to the second internal conductor.
1. A multilayer glass ceramic substrate comprising:
a plurality of insulating layers composed of glass ceramics;
an embedded resistor formed between the insulating layers, wherein the resistor includes scattered microvoids and is comprised of materials containing conductive powders and glass powders, wherein an average size of the scattered microvoids is 3 μm or less, and wherein the average size of the scattered microvoids is 0.92 μm or more; and
a first and a second internal conductor, wherein a first end of the embedded resistor is connected to the first internal conductor and a second end of the embedded resistor is connected to the second internal conductor;
wherein a softening point of glass powders used for the resistor is expressed by Tr 1 ;
wherein the softening point of glass powders used for the insulating layers is expressed by Tc 1 ;
wherein Tc 1-110 ≦Tr 1 ≦Tc 1 +70 in degrees Celsius; and
wherein 750° C.≦Tc 1 ≦800° C.
2. The multilayer glass ceramic substrate according to claim 1 , wherein the insulating layer comprises a crystallized glass having a diopside crystal, that contains SiO 2 , CaO, and MgO, as a main phase.
3. The multilayer glass ceramic substrate according to claim 1 , wherein the proportion of the microvoids in the resistor on a cross section of the resistor that is parallel to a laminating surface of the multilayer glass ceramic substrate is 20% or less.
4. The multilayer glass ceramic substrate according to claim 2 , wherein the proportion of the microvoids in the resistor on a cross section of the resistor that is parallel to a laminating surface of the multilayer glass ceramic substrate is 20% or less.