IP Library Granted Patent US 9,136,448
Granted Patent B2
US 9,136,448 · App. 14/366,294 · Granted Sep 15, 2015

Semiconductor light emitting device lamp that emits light at large angles

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Quick Facts
Patent No.
US 9,136,448
App. No.
14/366,294
Granted
Sep 15, 2015
Kind
B2
Abstract

Embodiments of the invention include a plurality of semiconductor light emitting diodes attached to a mount. A plurality of lenses are disposed over the plurality of semiconductor light emitting diodes. A lens disposed over a semiconductor light emitting diode proximate an edge of the mount is rotationally asymmetrical and is shaped such that for a portion of the lens light emitted at an intensity that is half a maximum intensity is emitted at an angle of at least 70° relative to a normal to a top surface of the semiconductor light emitting diode.

Claims (23)

1. A structure comprising:

a plurality of semiconductor light emitting diodes attached to a mount, the mount having a plurality of edges and a center; and

one or more first lenses disposed over a first subset of the semiconductor light emitting diodes proximate one of the edges of the mount wherein the first lenses are rotationally asymmetrical; and

one or more second lenses disposed over second subset of the plurality of semiconductor light emitting diodes proximate the center of the mount wherein the second lenses are rotationally symmetrical,

wherein the first lenses are shaped such that for a portion of the lens, light emitted at an intensity that is half a maximum intensity is emitted at an angle of at least 80° relative to a normal to a top surface of the semiconductor light emitting diode.

2. The structure of claim 1 wherein the first lenses are shaped such that for a portion of the lens, light emitted at an intensity that is half a maximum intensity is emitted at an angle less than 70° relative to a normal to a top surface of the semiconductor light emitting diode.

3. A structure comprising:

a plurality of semiconductor light emitting diodes attached to a mount, the mount having a plurality of edges and a center; and

one or more first lenses disposed over a first subset of the semiconductor light emitting diodes proximate one of the edges of the mount wherein the first lenses are rotationally asymmetrical;

one or more second lenses disposed over second subset of the plurality of semiconductor light emitting diodes proximate the center of the mount wherein the second lenses are rotationally symmetrical; and

a shell disposed over the plurality of light emitting diodes,

wherein the structure is configured such that light escapes the shell at an angle of 135° relative to a normal to a top surface of the mount;

wherein an amount of light emitted at an angle of 135° relative to the normal to the top surface of the mount is at least 5% of an amount of light emitted at an angle where an intensity of light emitted is at a maximum.

4. The structure of claim 3 wherein the shell comprises a material that causes scattering of light.

5. The structure of claim 3 wherein the shell extends below a bottom of the mount.

6. A device comprising:

a plurality of light emitting diodes attached to a top surface of a mount embedded in a plane, the mount having a plurality of edges and a center; and

one or more first lenses disposed over a first subset of the light emitting diodes wherein the first lenses are rotationally asymmetrical; and

one or more second lenses disposed over second subset of the plurality of light emitting diodes wherein the second lenses are rotationally symmetrical,

wherein the first and second sent of lenses are arranged to direct light above and below the plane.

7. The structure of claim 6 further comprising a shell disposed over the plurality of light emitting diodes, wherein the combination of the first and second lenses and the shell direct light above and below the plane.

8. The structure of claim 7 wherein the shell comprises a material that causes scattering of light.

9. The structure of claim 7 wherein the shell extends below the plane.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044416/0019 →
CHANGE OF NAME Recorded Nov 8, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 044723/0025 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY NAME PREVIOUSLY RECORDED AT REEL: 033191 FRAME: 0201. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Oct 17, 2017
From: BIERHUIZEN, SERGE JOEL ARMAND
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 044218/0808 →
SECURITY INTEREST Recorded Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2014
From: BIERHUIZEN, SERGE JOEL ARMAND
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 033191/0201 →