Circuit carrier having a conducting path and an electric shield
The invention relates to a circuit carrier ( 11 ), comprising a digital circuit, which contains at least two components ( 12, 14 ) that are electrically connected to each other ( 19, 21, 20 ). Additionally, an electric shield ( 24 ) is provided. According to the invention, the electric shield ( 24 ) and a conducting path ( 21 ) for electrically connecting the components ( 12, 14 ) are realized by means of a single layered composite ( 18 ). In particular, the electric shield ( 24 ) and the conducting path ( 21 ) are formed by the same electrically conductive layer, wherein a hole ( 25 ) ensures complete electrical insulation of the conducting path ( 21 ) from the shield ( 24 ). The invention further relates to a method for producing such a circuit carrier.
1. A circuit carrier comprising:
a digital circuit, in which at least two components are electrically connected via a conducting path; and
an electric shield that spans at least one component of the at least two components,
wherein the electric shield and the conducting path are configured in layers of a layered structure of the circuit carrier, and the layers cover the at least two components,
wherein a layer of the layered structure having the electric shield, the conducting path, or the electric shield and the conducting path is disposed on an electrically-insulating layer,
wherein a first component of the at least two components is supported by a first side of the electrically-insulating layer and a second component of the at least two components is supported by a ground layer that abuts a second side of the electrically-insulating layer,
wherein the electric shield and the conducting path are realized in and from a same conducting structured layer of the layered structure, and
wherein the conducting path is completely separated from the electric shield by a hole.
2. The circuit carrier of claim 1 , wherein the electrically-insulating layer has through-holes to contact surfaces of the at least two components, through-holes to a frame ground connection of the circuit carrier, or the through-holes to the contact surfaces of the at least two components and the through-holes to the frame ground connection of the circuit carrier.
3. The circuit carrier of claim 2 , wherein the electrically-insulating layer includes a photostructured material.
4. The circuit carrier of claim 1 , wherein the structured layer having the electric shield has cutouts in an area of the electric shield.
5. The circuit carrier of claim 1 , wherein a layer having the electric shield, the conducting path, or the electric shield and the conducting path is provided with an electrically-conducting strengthening layer.
6. The circuit carrier of claim 5 , wherein the layer having the electric shield and the strengthening layer have cutouts in an area of the electric shield.
7. The circuit carrier of claim 1 , wherein the circuit carrier, with all layers located thereon, is provided with an electrically-insulated seal.
8. The circuit carrier of claim 3 , wherein the structured layer having the electric shield has cutouts in an area of the electric shield.
9. The circuit carrier of claim 3 , wherein a layer having the electric shield, the conducting path, or the electric shield and the conducting path is provided with an electrically-conducting strengthening layer.
10. The circuit carrier of claim 9 , wherein the layer having the electric shield and the strengthening layer have cutouts in an area of the electric shield.
11. The circuit carrier of claim 3 , wherein the circuit carrier, with all layers located thereon, is provided with an electrically-insulated seal.
12. The circuit carrier of claim 1 , wherein the circuit carrier, with all layers located thereon, is provided with an electrically-insulated seal.