Stencils

1. A stencil for printing a pattern of deposits on a substrate, wherein the stencil comprises an electroformed metal sheet which has a first layer which includes an apertured region through which a printing medium is applied in a printing operation, wherein the apertured region has the form of a grid which comprises orthogonally-arranged web elements, which together define apertures therebetween, and a second layer which overlies a substrate to be printed and includes a plurality of separated apertures, wherein the apertures of the second layer extend across and beyond the apertured region in the first layer, with the apertures in the second layer being arranged in the form of a regular array which repeats laterally across and outwardly beyond the apertured region of the first layer, and wherein the apertures of the second layer disposed adjacent and outwardly of the apertured region in the first layer are blind apertures and the apertures of the second layer disposed inwardly of and enclosed by the blind apertures are through apertures, each having a pattern corresponding to that to be printed on the substrate.

2. The stencil of claim 1 , wherein the metal sheet is formed of nickel or a nickel alloy.

3. The stencil of claim 1 , wherein the layers of the stencil are integrally formed.

4. The stencil of claim 1 , wherein the apertured region corresponds in shape and size to the substrate to be printed.

5. The stencil of claim 4 , wherein the apertured region is circular in shape.

6. The stencil of claim 1 , wherein the apertures of the first layer are rectangular.

7. The stencil of claim 6 , wherein the web elements of the first layer have a width of from about 10 μm to about 120 μm, from about 20 μm to about 110 μm, from about 30 μm to about 100 μm, about 30 μm or about 100 μm.

8. The stencil of claim 7 , wherein the web elements of the first layer have a width of from about 10 μm to about 40 μm, from about 20 μm to about 40 μm or about 30 μm.

9. The stencil of claim 7 , wherein the web elements of the first layer have a width of from about 80 μm to about 120 μm, from about 90 μm to about 110 μm or about 100 μm.

10. The stencil of claim 1 , wherein the apertures of the first layer have an area of at least about 0.001 mm 2 , from about 0.001 mm 2 to about 1 mm 2 , at least about 0.0015 mm 2 , from about 0.0015 mm 2 to about 1 mm 2 , at least about 0.0025 mm 2 , from about 0.0025 mm 2 to about 1 mm 2 or not more than about 0.25 mm 2 .

11. The stencil of claim 1 , wherein the apertures of the first layer have side lengths of at least about 50 μm, at least about 100 μm, at least about 250 μm or not more than about 1 mm.

12. The stencil of claim 1 , wherein the first layer has a thickness of from about 10 μm to about 120 μm, from about 20 μm to about 110 μm, from about 30 μm to about 100 μm, about 30 μm or about 100 μm.

13. The stencil of claim 12 , wherein the first layer has a thickness of from about 20 μm to about 60 μm, from about 20 μm to about 50 μm, from about 25 μm to about 35 μm or about 30 μm.

14. The stencil of claim 12 , wherein the first layer has a thickness of from about 80 μm to about 120 μm, from about 90 μm to about 110 μm or about 100 μm.

15. The stencil of claim 1 , wherein the apertures in the second layer each have a substantially square form, separated by orthogonally-arranged web elements.

16. The stencil of claim 15 , wherein the web elements of the second layer have a width of from about 100 μm to about 200 μm or from about 100 μm to about 150 μm.

17. The stencil of claim 1 , wherein the apertures of the second layer extend laterally beyond the apertured region of the first layer by a distance of at least about 2 mm, from about 2 mm to about 30 mm, from about 2 mm to about 20 mm, at least about 5 mm, from about 5 mm to about 20 mm or from about 5 mm to about 10 mm.

18. The stencil of claim 1 , wherein the layers are formed of the same material or different materials.

19. The stencil of claim 1 , wherein the substrate is (a) a wafer, a silicon wafer or a sapphire wafer, or (b) a transfer carrier for transferring the prints to a wafer, a silicon wafer or a sapphire wafer.

20. A method of printing substrates with a pattern of deposits, comprising:

providing a substrate;

providing a stencil for printing a pattern of deposits on a substrate, wherein the stencil comprises an electroformed metal sheet which has a first layer which includes an apertured region through which a printing medium is applied in a printing operation, wherein the apertured region has the form of a grid which comprises orthogonally-arranged web elements, which together define apertures therebetween, and a second layer which overlies a substrate to be printed and includes a plurality of separated apertures, wherein the apertures of the second layer extend across and beyond the apertured region in the first layer, with the apertures in the second layer being arranged in the form of a regular array which repeats laterally across and outwardly beyond the apertured region of the first layer, and wherein the apertures of the second layer disposed adjacent and outwardly of the apertured region in the first layer are blind apertures and the apertures of the second layer disposed inwardly of and enclosed by the blind apertures are through apertures, each having a pattern corresponding to that to be printed on the substrate; and

applying print medium over the stencil, such that the print medium is forced through the apertures in the second layer and a pattern of deposits is printed on the substrate corresponding to the pattern of through apertures in the second layer of the stencil.

21. The method of claim 20 , wherein the substrate is a wafer, and the deposits are printed directly onto dies formed in the wafer without any intermediate transfer steps.

22. A method of fabricating light-emitting devices, comprising:

providing a substrate, wherein the substrate is a wafer having dies formed therein;

providing a stencil for printing a pattern of deposits on the substrate, wherein the stencil comprises an electroformed metal sheet which has a first layer which includes an apertured region through which a printing medium is applied in a printing operation, and a second layer which overlies a substrate to be printed and includes a plurality of separated apertures, wherein the apertures of the second layer extend across and beyond the apertured region in the first layer, with the apertures in the second layer being arranged in the form of a regular array which repeats laterally across and outwardly beyond the apertured region of the first layer, and wherein the apertures of the second layer include a plurality of through apertures in registration with the apertured region of the first layer, each having a pattern corresponding to that to be printed on the substrate, and a plurality of blind apertures disposed adjacent and outwardly of the apertured region in the first layer;

applying print medium over the stencil, such that the print medium is forced through the apertures in the second layer and a pattern of deposits is printed on the substrate to provide printed dies corresponding to the pattern of through apertures in the second layer of the stencil;

separating the printed dies of the wafer;

selecting a plurality of the separated printed dies; and

providing the selected printed dies in device packaging to provide light-emitting devices.

23. The method of claim 22 , wherein at least 90% of the separated printed dies are selected in the separating step.

24. The method of claim 23 , wherein the deposits on the selected printed dies are not subjected to any surface thickness processing.