Method for producing laminated polishing pad
View Patent ↗A method for producing a laminated polishing pad, which is free from warpage and does not cause peeling between a polishing layer and a cushion layer during polishing, includes the steps of: laminating a hot-melt adhesive sheet to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided; heating the laminated hot-melt adhesive sheet to be melted or softened; laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate; cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and peeling the thermoplastic resin base material from the laminated polishing sheet.
1. A method for producing a laminated polishing pad comprising the following steps in this order:
laminating a hot-melt adhesive sheet to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided;
heating the laminated hot-melt adhesive sheet to be melted or softened;
laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate;
cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and
peeling the thermoplastic resin base material from the laminated polishing sheet.
2. The method for producing a laminated polishing pad according to claim 1 , wherein the laminated polishing sheet is prepared by cutting the laminate to the size of the polishing layer before the melted or softened hot-melt adhesive is completely cured.
3. The method for producing a laminated polishing pad according to claim 2 , wherein the thermoplastic resin base material is peeled from the laminated polishing sheet after the hot-melt adhesive is completely cured.
4. The method for producing a laminated polishing pad according to claim 1 , wherein the laminated polishing sheet is prepared by cutting the laminate to the size of the polishing layer when the temperature of the hot-melt adhesive is 40° C. or higher.
5. The method for producing a laminated polishing pad according to claim 1 , wherein the thermoplastic resin base material is formed by stretch forming.
6. The method for producing a laminated polishing pad according to claim 1 , wherein the melting temperature of the hot-melt adhesive is 140 to 170° C.
7. The method for producing a laminated polishing pad according to claim 1 , wherein the thermoplastic resin base material is a polyethylene terephthalate base material.
8. The method for producing a laminated polishing pad according to claim 1 , comprising the step of providing a pressure-sensitive double-sided tape, which has a pressure-sensitive adhesive layer on both surfaces of a thermoplastic resin sheet, on a surface of the cushion layer from which the thermoplastic resin base material is peeled.
9. A method for producing a laminated polishing pad comprising the following steps in this order:
applying a melted or softened hot-melt adhesive to a surface of a cushion layer with a base material in which a thermoplastic resin base material is provided peelably on one surface of the cushion layer, on which the thermoplastic resin base material is not provided;
laminating a polishing layer on the melted or softened hot-melt adhesive to prepare a laminate;
cutting the laminate to the size of the polishing layer to prepare a laminated polishing sheet; and
peeling the thermoplastic resin base material from the laminated polishing sheet.
10. The method for producing a laminated polishing pad according to claim 9 , wherein the laminated polishing sheet is prepared by cutting the laminate to the size of the polishing layer before the melted or softened hot-melt adhesive is completely cured.
11. The method for producing a laminated polishing pad according to claim 10 , wherein the thermoplastic resin base material is peeled from the laminated polishing sheet after the hot-melt adhesive is completely cured.
12. The method for producing a laminated polishing pad according to claim 9 , wherein the laminated polishing sheet is prepared by cutting the laminate to the size of the polishing layer when the temperature of the hot-melt adhesive is 40° C. or higher.
13. The method for producing a laminated polishing pad according to claim 9 , wherein the thermoplastic resin base material is formed by stretch forming.
14. The method for producing a laminated polishing pad according to claim 9 , wherein the melting temperature of the hot-melt adhesive is 140 to 170° C.
15. The method for producing a laminated polishing pad according to claim 9 , wherein the thermoplastic resin base material is a polyethylene terephthalate base material.
16. The method for producing a laminated polishing pad according to claim 9 , comprising the step of providing a pressure-sensitive double-sided tape, which has a pressure-sensitive adhesive layer on both surfaces of a thermoplastic resin sheet, on a surface of the cushion layer from which the thermoplastic resin base material is peeled.