Organic light-emitting device having a matrix material embedded with heat conducting particles
View Patent ↗Various embodiments relates to an organic light-emitting device, including at least one functional layer for generating electroluminescent radiation, an encapsulation structure formed on or over the at least one functional layer, and a heat conduction layer formed on or over the encapsulation structure. The heat conduction layer includes a matrix material and heat conducting particles embedded in the matrix material.
1. An organic light-emitting device, comprising:
at least one functional layer for generating electroluminescent radiation;
a glass encapsulation structure formed on or over the at least one functional layer; and
a heat conduction layer formed on or over the glass encapsulation structure, the heat conduction layer comprising a matrix material and heat conducting particles embedded in the matrix material.
2. The organic light-emitting device as claimed in claim 1 , wherein the heat conducting particles comprise a material having a thermal conductivity of at least 200 W/(m·K).
3. The organic light-emitting device as claimed in claim 1 , wherein the heat conducting particles comprise at least one of
a metal;
carbon or a conductive carbon modification or carbon compound;
silicon or a conductive silicon compound;
a metal oxide; and
a metal salt.
4. The organic light-emitting device as claimed in claim 1 , wherein the heat conductive particles comprise carbon nanotubes.
5. The organic light-emitting device as claimed in claim 1 , wherein the matrix material comprises an adhesive material.
6. The organic light-emitting device as claimed in claim 1 , wherein the heat conduction layer is formed directly on the glass encapsulation structure.
7. The organic light-emitting device as claimed in claim 1 , further comprising a layer for reducing the reflectivity and/or improving the emissivity, which is formed on or over the heat conduction layer.
8. The organic light-emitting device as claimed in claim 1 , wherein the glass encapsulation structure is formed as thin-layer encapsulation.
9. The organic light-emitting device as claimed in claim 1 , further comprising a layer having a rib pattern, which is formed on or over the heat conduction layer.
10. The organic light-emitting device as claimed in claim 1 , wherein the heat conduction layer has a thickness in the range of from approximately 100 μm to approximately 2 mm.
11. The organic light-emitting device as claimed in claim 1 , further comprising at least one additional heat conduction layer, which is formed on or over the heat conduction layer.
12. The organic light-emitting device as claimed in claim 1 , wherein the heat conduction layer covers the glass encapsulation structure over its entire surface.
13. The organic light-emitting device as claimed in claim 1 , configured as an organic light-emitting diode.