Connecting power leads to circuit board

1. A method comprising:

receiving a circuit board, the circuit board including a first node and a second node that are electrically isolated from each other, the second node electrically coupled to circuitry residing on the circuit board;

initiating contact of a conductive lead of a battery to the first node; and

producing an electrical connection between the conductive lead and the second node to electrically couple the conductive lead to the circuitry residing on the circuit board.

2. The method as in claim 1 , wherein producing the electrical connection includes:

applying a mass of solder to a combination of the first node, the second node, and the conductive lead to electrically connect a combination of the conductive lead and the first node to the second node.

3. The method as in claim 1 , wherein the first node is a through-hole disposed on the circuit board; and

wherein initiating contact of the conductive lead to the first node includes inserting the conductive lead through the through-hole.

4. The method as in claim 1 , wherein the first node is a first surface pad disposed on the circuit board;

wherein the second node is a second surface pad disposed on the circuit board; and

wherein initiating contact of the conductive lead to the first node includes contacting an axial end of the conductive lead to the first surface pad.

5. The method as in claim 4 , wherein the conductive lead is a live conductive lead of the battery, wherein the initiating of the contact of the conductive lead to the first node includes initiating the contact of the live conductive lead of the battery to the first node, and wherein the producing of the electrical connection includes producing the electrical connection between the live conductive lead of the battery and the second node to electrically couple the live conductive lead to the circuitry residing on the circuit board.

6. A method comprising:

receiving a circuit board including pairings of nodes, each of the pairings including a primary node and a secondary node, each respective primary node in a pair disposed adjacent to a respective secondary node in the pair, the respective primary node electrically isolated from the respective secondary node in the pair;

for each respective pair of the pairings, positioning a respective conductive lead of a battery in a vicinity of a corresponding primary node in the respective pair; and

providing electrical connectivity between each of the multiple conductive leads and the secondary nodes, the electrical connectivity completing a conductive circuit path connecting the multiple conductive leads to circuitry disposed on the circuit board.

7. The method as in claim 6 , wherein the positioning of the respective conductive lead of the battery in the vicinity of the corresponding primary node in the respective pair includes:

inserting the respective conductive lead through the corresponding primary node, the corresponding primary node being a corresponding hole in the circuit board.

8. The method as in claim 6 further comprising:

contacting the respective conductive lead to the corresponding primary node in the respective pair.

9. The method as in claim 6 , wherein providing the electrical connectivity includes providing a respective solder connection between each of the multiple conductive leads and corresponding secondary nodes.

10. The method as in claim 6 further comprising:

providing the electrical connectivity between each of the multiple conductive leads and corresponding secondary nodes in a pre-specified order.

11. The method as in claim 10 , wherein the multiple conductive leads supply different magnitudes of live voltages to the circuit board.