Organic light-emitting device and method for producing same

1. An organic light-emitting device, comprising:

an underlayer disposed above a substrate;

a partition wall that covers a first part of a surface of the underlayer and surrounds a second part of the surface of the underlayer; and

an organic film that includes organic material, is disposed in a recess formed by the partition wall surrounding the second part, and is in contact with the surface of the underlayer and a surface of the partition wall, wherein

the surface of the underlayer has a protruding portion that protrudes in an upward direction, to a greater height than a portion of the second part that does not overlap with the protruding portion, the protruding portion being composed of a top surface and an inclined surface, the inclined surface surrounding the top surface in a plan view, and

the first part includes at least the top surface and a portion of the inclined surface, and an innermost edge of the partition wall is in contact with the inclined surface or a level portion of the surface of the underlayer that is not the protruding portion.

2. The organic light-emitting device of claim 1 , wherein

the organic film is formed by drying an applied film that is formed by applying ink that contains the organic material, and

( b/a 2)≦15

where a2 is an average film thickness in nanometers of the organic film above the level portion and b is a difference in height in nanometers of a position where the innermost edge of the partition wall contacts the surface of the underlayer and the level portion.

3. The organic light-emitting device of claim 1 , wherein

the organic film is formed by drying an applied film that is formed by applying ink that contains the organic material,

the applied film covers an entirety of the level portion, a portion of the inclined surface not covered by the partition wall, and a portion of the partition wall,

the applied film has a film thickness of a1 nanometers that is greater than b nanometers, and

( b/a 2)≦15

where a2 is an average film thickness in nanometers of the organic film above the level portion and b is a difference in height in nanometers of a position where the innermost edge of the partition wall contacts the surface of the underlayer and the level portion.

4. The organic light-emitting device of claim 1 , wherein

a difference in height of a position where the innermost edge of the partition wall contacts the surface of the underlayer and the level portion is not more than 150 nanometers.

5. The organic light-emitting device of claim 1 , wherein

the underlayer includes an interlayer insulating film that has a contact hole and an electrode that is disposed on a surface of the interlayer insulating film and surfaces defining the contact hole,

the organic film is formed by drying an applied film that is formed by applying, on a surface of the electrode, ink that contains the organic material,

the surface of the interlayer insulating film has a protruding portion in a periphery of the contact hole that protrudes in an upward direction,

the electrode is disposed so as to follow the surface of the interlayer insulating film, such that a portion of the surface of the electrode above the protruding portion of the interlayer insulating film protrudes in an upward direction, and

the surface of the electrode is the surface of the underlayer.

6. A method for manufacturing an organic light-emitting device, the method comprising:

forming an underlayer above a substrate;

forming a partition wall on the underlayer that covers a first part of a surface of the underlayer and surrounds a second part of the surface of the underlayer;

forming an applied film by applying ink that contains organic material into a recess formed by the partition wall surrounding the second part; and

forming, by drying the applied film, an organic film that is in contact with the surface of the underlayer and the surface of the partition wall, wherein

in forming the underlayer, the surface of the underlayer has a protruding portion that protrudes in an upwards direction, to a greater height than a portion of the second part that does not overlap with the protruding portion, the protruding portion being composed of a top surface and an inclined surface, the inclined surface surrounding the top surface in a plan view, and

in forming the partition wall, the first part includes at least the top surface and a portion of the inclined surface, such that an innermost edge of the partition wall is in contact with the inclined surface or a level portion of the surface of the underlayer that is not the protruding portion.

7. A method for manufacturing an organic light-emitting device, the method comprising:

forming an underlayer above a substrate;

forming a partition wall on the underlayer that covers a first part of a surface of the underlayer and surrounds a second part of the surface of the underlayer;

forming an applied film by applying ink that contains organic material into a recess formed by the partition wall surrounding the second part; and

forming, by drying the applied film, an organic film that is in contact with the surface of the underlayer and the surface of the partition wall, wherein:

in forming the underlayer, the surface of the underlayer has a protruding portion that protrudes in an upwards direction, to a greater height than a portion of the second part that does not overlap with the protruding portion, the protruding portion being composed of a top surface and an inclined surface, the inclined surface surrounding the top surface in a plan view;

in forming the partition wall, the first part includes at least the top surface and a portion of the inclined surface, such that an innermost edge of the partition wall is in contact with the inclined surface or a level portion of the surface of the underlayer that is not the protruding portion;

in forming the applied film, the applied film is applied so as to cover an entirety of the level portion, a portion of the inclined surface of the protruding portion not covered by the partition wall, and a portion of the partition wall, and is applied so as to have a film thickness of a1 nanometers that is greater than b nanometers; and

in forming the organic film,

a 1> a 2≧( b/ 15)

where a2 is an average film thickness in nanometers of the organic film above the level portion and b is a difference in height in nanometers of a position where the innermost edge of the partition wall contacts the surface of the underlayer and the level portion.

8. The organic light-emitting device of claim 1 , wherein

the innermost edge of the partition wall contacts the inclined surface of the protruding portion of the underlayer.

9. The organic light-emitting device of claim 1 , wherein

the underlayer includes a contact hole, and

the protruding portion surrounds the contact hole in the plan view.

10. The organic light-emitting device of claim 9 , wherein

the contact hole comprises a cylindrical shape, and

the top surface of the protruding portion and the inclined surface of the protruding portion each surround the contact hole in the plan view.

11. The organic light-emitting device of claim 10 , wherein

the partition wall is in the contact hole.

12. The organic light-emitting device of claim 1 , wherein

the inclined surface of the protruding portion has a band-shape that surrounds the top surface in the plan view.

13. The organic light-emitting device of claim 1 , wherein

the inclined surface of the protruding portion circumferentially surrounds the top surface in the plan view.