Method for producing a multilayer component
A method can be used for producing a fully active stack. A stack has the sides A, B, C and D running along the stacking direction. The method includes combining and temporarily making contact with the internal electrodes that make contact with the respective side on one of the sides B or D, such that the internal electrodes that make contact with the respective side can be electrically driven selectively. The electrically driven internal electrodes are electrochemically coated on the sides A and C. The stack is singulated to form a fully active stack with the electrochemically coated internal electrodes on the sides A′ and C′. A method for producing a multilayer component comprising the fully active stack and a fully active multilayer component producible according to the method are furthermore proposed.
1. A method for producing a fully active stack or a green precursor of the fully active stack, the method comprising:
providing a sintered or unsintered stack having sides A, B, C and D running in each case in a stacking direction, the stack comprising a plurality of alternately successive ceramic dielectric layers and internal electrode layers, wherein the internal electrode layers are internal electrodes and are embodied in each case in a continuous fashion with respect to the sides A and C and are embodied in each case in a non-continuous fashion with respect to either the side B or the side D, such that one portion of the internal electrodes makes contact with the side B, but not with the side D, and another portion of the internal electrodes makes contact with the side D, but not with the side B;
combining and temporarily contacting the internal electrodes that make contact with one of the side B or the side D via an external contact with temporary isozones, such that the internal electrodes that make contact with the side B or the side D are selectively electrically drivable;
etching back at least one portion of the internal electrodes that make contact with the side B or the side D before electrochemically coating;
electrochemically coating the internal electrodes that make contact with the side B or the side D on the sides A and C beyond an etching depth, wherein the electrochemically coating is effected by a plating technology;
converting the electrochemical coating into an insulating oxide coating by electrochemical oxidation; and
singulating the stack to form the fully active stack or the green precursor of the fully active stack with the coated internal electrodes on sides A′ and C′, wherein the sides A′ and C′ correspond to the sides A and C, respectively, after the stack is singulated.
2. The method according claim 1 , wherein the etching back comprises electrochemical machining.
3. The method according to claim 1 , further comprising, after the electrochemical coating, covering uncoated internal electrodes with an insulating material.
4. The method according to claim 1 , wherein a metal or a metal mixture that differs from metal of the internal electrode is used as an electrolytic coating material.
5. The method according to claim 1 , wherein trenches that are not filled again after the etching-back are closed by sintering.
6. The method according to claim 1 , wherein the electrochemical coating is carried out in an aqueous NaCl solution as electrolyte.
7. The method according to claim 1 , wherein the internal electrode layers comprise silver, a silver alloy, or copper.
8. The method according to claim 1 , further comprising applying external electrodes on the sides A′ and C′ of the fully active stack and contacting the electrochemically coated or uncoated internal electrodes, such that the external electrodes are electrically connected either to the electrochemically coated or to electrochemically uncoated internal electrode layers.
9. The method according to claim 8 , further comprising sintering the fully active stack or the green precursor.
10. A method for producing a fully active stack or a green precursor of the fully active stack, the method comprising:
providing a sintered or unsintered stack having sides A, B, C and D running in each case in a stacking direction, the stack comprising a plurality of alternately successive ceramic dielectric layers and internal electrode layers, wherein the internal electrode layers are internal electrodes and are embodied in each case in a continuous fashion with respect to the sides A and C and are embodied in each case in a non-continuous fashion with respect to either the side B or the side D, such that one portion of the internal electrodes makes contact with the side B, but not with the side D, and another portion of the internal electrodes makes contact with the side D, but not with the side B;
combining and temporarily contacting the internal electrodes that make contact with one of the side B or the side D via an external contact with temporary isozones, such that the internal electrodes that make contact with the side B or the side D are selectively electrically drivable;
etching back at least one portion of the internal electrodes that make contact with the side B or the side D before electrochemically coating;
electrochemically coating the internal electrodes that make contact with the side B or the side D on the sides A and C, wherein the electrochemically coating is effected by a plating technology;
converting the electrochemical coating into an insulating oxide coating by electrochemical oxidation; and
singulating the stack to form the fully active stack or the green precursor of the fully active stack with the coated internal electrodes on sides A′ and C′, wherein the sides A′ and C′ correspond to the sides A and C, respectively, after the stack is singulated.
11. The method according claim 10 , wherein etching back comprises electrochemical machining.
12. The method according to claim 10 , further comprising, after the electrochemically coating, covering uncoated internal electrodes with an insulating material.
13. The method according to claim 10 , wherein a metal or a metal mixture that differs from the metal of the internal electrode is used as an electrolytic coating material.
14. The method according to claim 10 , wherein trenches that are not filled again after the etching-back are closed by sintering.
15. The method according to claim 10 , wherein the electrochemical coating is carried out in an aqueous NaCl solution as electrolyte.
16. The method according to claim 10 , wherein the internal electrode layers comprise silver.
17. The method according to claim 10 , wherein the internal electrode layers comprise a silver alloy.
18. The method according to claim 10 , wherein the internal electrode layers comprise copper.
19. The method according to claim 10 , further comprising applying external electrodes on the sides A′ and C′ of the fully active stack by contacting uncoated internal electrodes, such that the external electrodes are electrically connected to the uncoated internal electrodes.
20. The method according to claim 19 , further comprising sintering the fully active stack or the green precursor.