Method of manufacturing a MEMS micro-mirror assembly

1. A method of manufacturing a MEMS micro mirror assembly, comprising the steps of:

mounting a PCB board on a metallic plate;

mounting a MEMS device on the PCB board, wherein the MEMS device comprises a MEMS die and a magnet;

mounting an alignment mask on the PCB board, wherein the alignment mask comprises a grid;

using the grid of the alignment mask to position one or more MEMS devices on the PCB board when mounting the one or more MEMS devices on the PCB board;

wherein the step of using the grid of the alignment mask to position one or more MEMS devices on the PCB board comprises, positioning a single MEMS device in one or more apertures defined in the grid, and arranging the or each MEMS device so that at least a first and second side of the or each MEMS device contacts the grid.

2. A method according to claim 1 , wherein the step of mounting the MEMS device on the PCB board, comprises the steps of first mounting the magnet of the MEMS device on the PCB board and then mounting the MEMS die on the magnet.

3. A method according to claim 1 , wherein the step of mounting the MEMS device on the PCB board comprises fixing the MEMS device to the PCB board.

4. A method according to claim 1 , comprising the step of mounting a plurality of MEMS devices on the PCB board.

5. A method according to claim 4 comprising the step of dividing the PCB board to provide a plurality of mechanically independent MEMS assemblies, each MEMS assembly comprising a single MEMS device mounted on a segment of the PCB board.

6. A method according to claim 1 , wherein the method further comprises the step of securing the alignment mask to the PCB board before the one or more MEMS devices are mounted on the PCB board, and removing the alignment mask from the PCB board after the or each MEMS device has been mounted on the PCB board.

7. A method according to claim 1 , wherein the method comprises the step of positioning a MEMS device such that a first and second side of a MEMS device abuts the grid of the alignment mask and an edge of the MEMS device, which is located at an interface between the first and second sides, is located in a cut-out, which is provided in the grid, so that the edge of the MEMS device remains remote from the grid when the first and second sides of the MEMS device contact the grid.

8. A method according to claim 1 , further comprising the step of electrically connecting a MEMS device to the PCB board by arranging one or more wire bonds to electrically connect one or more electrical pads on the MEMS device to one or more electrical pads on the PCB board.

9. A method according to claim 1 , comprising the step of arranging one or more wire bonds to electrically connect one or more electrical pads on the MEMS device to one or more electrical pads provide on a first extension portion on the PCB board which extends from beneath the MEMS device.

10. A method according to claim 8 , wherein the PCB board comprises a first and second extension portions which each extend from beneath the MEMS device, comprising the step of arranging one or more wire bonds to electrically connect one or more electrical pads on the MEMS device to one or more electrical pads provide on the second extension portion of the PCB board.

11. A method according to claim 8 further comprising the step arranging a protective material to form an enclosure which encloses, the one or more wire bonds.

12. A method according to claim 1 , comprising the step of fixing the MEMS device to the PCB board and dismounting a PCB board from the metallic plate after the MEMS device is fixed to the PCB board.

13. A MEMS micro minor assembly comprising:

a MEMS device mounted on the PCB board, wherein the MEMS device comprises a MEMS die and a magnet, wherein the PCB board is further mounted on a metallic plate; an alignment mask which is mounted on the PCB board, wherein the alignment mask comprises a grid; and wherein the MEMS device is positioned in an aperture defined in the grid, and arranging so that at least a first and second side of the MEMS device contacts the grid.