IP Library Granted Patent US 10,351,957
Granted Patent B2
US 10,351,957 · App. 14/384,603 · Granted Jul 16, 2019

Method for producing metal oxide film and metal oxide film

Inventors: Takahiro Shirahata (Tokyo, JP); Hiroyuki Orita (Tokyo, JP); Takahiro Hiramatsu (Tokyo, JP)
Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
C23C18/1216C23C18/1258C23C18/1291C23C18/1295C23C18/14H01B1/08H01L31/1884Y02E10/50
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Quick Facts
Patent No.
US 10,351,957
App. No.
14/384,603
Granted
Jul 16, 2019
Kind
B2
Abstract

In a method for producing a metal oxide film according to the present invention, a solution containing zinc is sprayed onto a substrate placed under non-vacuum, and then, a dopant solution containing a dopant is sprayed onto the substrate. After that, a deposited metal oxide film is subjected to a resistance reducing treatment. A molar concentration of the dopant supplied to the substrate with respect to a molar concentration of the zinc supplied to the substrate is not less than a predetermined value.

Claims (12)

1. A method for producing metal oxide film, the method comprising:

(A) spraying a solution comprising zinc onto a substrate placed under non-vacuum;

(B) spraying a dopant solution comprising a dopant onto the substrate, wherein the dopant is at least one of boron, gallium, indium and aluminum; and

(C) performing, on a metal oxide film deposited on the substrate obtained after said spraying (A) and said spraying (B), a resistance reducing treatment by irradiating the metal oxide film with ultraviolet rays that does not involve rearrangement of crystals of the metal oxide film,

wherein a molar concentration of the dopant supplied to the substrate in said spraying (B) with respect to a molar concentration of zinc supplied to the substrate in said spraying is not less than 0.4% when the dopant is at least one of boron, indium and aluminum and is not less than 0.33% when the dopant is gallium.

2. The method according to claim 1 , further comprising

(D) spraying an oxidation source onto the substrate in said spraying (A) and said spraying (B).

3. The method according to claim 2 , wherein the solution in said spraying (A), the oxidation source in said spraying (D), and the dopant solution in said spraying (B) are supplied to the substrate through different systems.

4. The method according to claim 1 , wherein the dopant is boron.

5. The method according to claim 1 , wherein the dopant is gallium.

6. The method according to claim 1 , wherein the dopant is indium.

7. The method according to claim 1 , wherein the dopant is aluminum.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2014
From: SHIRAHATA, TAKAHIRO; ORITA, HIROYUKI; HIRAMATSU, TAKAHIRO
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 033724/0204 →
Continuity (1)
Related Publication 20150034885A1 · Feb 5, 2015