IP Library Granted Patent US 9,343,613
Granted Patent B2
US 9,343,613 · App. 14/385,510 · Granted May 17, 2016

Phosphor in inorganic binder for LED applications

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Quick Facts
Patent No.
US 9,343,613
App. No.
14/385,510
Granted
May 17, 2016
Kind
B2
Abstract

A method for fabricating an LED/phosphor structure is described where an array of blue light emitting diode (LED) dies are mounted on a submount wafer. A phosphor powder is mixed with an organic polymer binder, such as an acrylate or nitrocellulose. The liquid or paste mixture is then deposited over the LED dies or other substrate as a substantially uniform layer. The organic binder is then removed by being burned away in air, or being subject to an O 2 plasma process, or dissolved, leaving a porous layer of phosphor grains sintered together. The porous phosphor layer is impregnated with a sol-gel (e.g., a sol-gel of TEOS or MTMS) or liquid glass (e.g., sodium silicate or potassium silicate), also known as water glass, which saturates the porous structure. The structure is then heated to cure the inorganic glass binder, leaving a robust glass binder that resists yellowing, among other desirable properties.

Claims (8)

1. A light emitting device comprising:

a light emitting diode (LED) die mounted on a submount;

a porous phosphor layer supported by a transparent support structure, which overlies the LED die so that the phosphor layer is not in direct contact with the LED die, wherein the porous phosphor layer comprises phosphor grains sintered together; and

an inorganic transparent binder substantially filling spaces in the porous phosphor layer, the binder being formed by curing a sol-gel or liquid glass infused in the porous phosphor layer.

2. The device of claim 1 wherein the porous phosphor layer is supported by the transparent support structure which is remotely positioned over the LED die.

3. The device of claim 1 wherein the LED is one of a plurality of LED dies, and wherein the porous phosphor layer is supported by the transparent support structure which is remotely positioned over the plurality of LED dies.

4. The device of claim 1 wherein the transparent binder comprises either TEOS, MTMS, or MTES.

5. The device of claim 1 wherein the transparent support structure is a transparent lens between the LED die and the phosphor layer.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044809/0940 →
SECURITY INTEREST Recorded Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2014
From: DEEBEN, JOSEPHPUS PAULUS AUGUSTINUS; VAN STIJN, PATRICK HENRICUS JOHANNES
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 033744/0684 →