Substrate processing apparatus
A substrate processing apparatus includes a substrate holding means that holds a substrate horizontally, a substrate rotating means that rotates a substrate held by the substrate holding means about a vertical rotation axis passing through the substrate, a discharging member that discharges a processing liquid toward the substrate, and a high-temperature processing liquid pipe that supplies a processing liquid of a temperature higher than that of the discharging member to the flow passage. The discharging member includes a plurality of discharge ports respectively disposed at a plurality of positions different in distance from the rotation axis and a flow passage connected sequentially to the plurality of discharge ports in order from outside to inside. The discharging member discharges a processing liquid supplied from the flow passage to the plurality of discharge ports from the plurality of discharge ports toward the substrate.
1. A substrate processing apparatus comprising:
a substrate holding unit that holds a substrate horizontally;
a substrate rotating unit that rotates the substrate held by the substrate holding unit about a vertical rotation axis passing through the substrate;
an upward discharging member that is disposed under a position where the substrate is held by the substrate holding unit that includes a plurality of discharge ports respectively disposed at a plurality of positions different in distance from the rotation axis, and a flow passage connected sequentially to the plurality of discharge ports in order from outside to inside in a flow-through direction, and that discharges a processing liquid supplied from the flow passage in the flow-through direction to the plurality of discharge ports from the plurality of discharge ports toward the substrate; and
a first processing liquid pipe that supplies a processing liquid of a temperature higher than that of the upward discharging member to the flow passage;
wherein the upward discharging member further includes a disk-shaped discharging portion opposed in parallel to the substrate held by the substrate holding unit and provided with the plurality of discharge ports;
the flow passage includes a first flow passage provided in the discharging portion and disposed on a plane;
the first flow passage includes an upstream portion that is disposed in an upstream direction from an outermost discharge port among the plurality of discharge ports and the upstream portion extends from the rotation axis to an outer peripheral portion of the upward discharging member in the flowthrough direction, and a downstream portion connected to the upstream portion and disposed in a same plane as that of the upstream portion and extending in the flow-through direction to be closer to the rotation axis than the outermost discharge port; and
the plurality of discharge ports include two discharge ports disposed at different respective rotation radiuses from the rotation axis and adjacent in the flow-through direction.
2. The substrate processing apparatus according to claim 1 , wherein the flow passage extends from one to the other of two discharge ports adjacent in the flow-through direction, through a path different from a straight line to connect the two discharge ports when viewed in a direction perpendicular to the substrate held by the substrate holding unit.
3. The substrate processing apparatus according to claim 1 , further comprising:
a second processing liquid pipe that supplies the flow passage with a processing liquid of a temperature lower than that of a processing liquid that is supplied from the first processing liquid pipe to the flow passage;
a switching device capable of opening and closing an interior of the first processing liquid pipe and second processing liquid pipe such that a processing liquid is selectively supplied to the flow passage from either one of the first processing liquid pipe and second processing liquid pipe; and
a control device that, by controlling the switching device, executes a first processing liquid supplying step of supplying a processing liquid from the first processing liquid pipe to the flow passage, and a second processing liquid supplying step of supplying a processing liquid from the second processing liquid pipe to the flow passage after the first processing liquid supplying step.
4. The substrate processing apparatus according to claim 1 , further comprising:
a cooling structure including a cooling substance disposition space which is provided in an interior of the upward discharging member and in which a cooling substance to cool the upward discharging member is disposed.
5. The substrate processing apparatus according to claim 4 , wherein the cooling structure further includes a cooling member serving as the cooling substance, having a smaller specific heat than that of the upward discharging member.
6. The substrate processing apparatus according to claim 4 , wherein the cooling substance disposition space is separate from the flow passage and includes a cooling liquid retention space to retain a cooling liquid serving as the cooling substrate.
7. The substrate processing apparatus according to claim 6 , wherein the cooling liquid retention space is a sealed space filled with the cooling liquid.
8. The substrate processing apparatus according to claim 6 , wherein the cooling structure includes a cooling liquid flow passage serving as the cooling liquid retention space, a cooling liquid supply passage which is connected to the cooling liquid flow passage and supplies a cooling liquid to the cooling liquid flow passage, and a cooling liquid discharge passage which is connected to the cooling liquid flow passage and discharges a cooling liquid in the cooling liquid flow passage.