LED MODULE, LIGHTING DEVICE, AND LAMP

1 - 14 . (canceled)

15 . An LED module comprising:

an opaque substrate on which a wiring circuit is provided;

a submount bonded to a surface of the opaque substrate with a first bond;

an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and

wires electrically connecting the LED chip to the wiring circuit,

the first bond and the second bond each allowing light emitted from the LED chip to pass therethrough,

the submount being a light-transmissive member,

the LED chip including:

a LED structure portion including a n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer; and

a substrate being transparent to light emitted from the light-emitting layer,

the LED structure portion provided on a main surface of the substrate,

the substrate being situated closer to the light-transmissive member than the LED structure portion,

the light-transmissive member having a planar size greater than a planar size of the LED chip, and

the transparent member allowing parts of the light emitted from the light-emitting layer of the LED chip towards the transparent member to be diffused in the light-transmissive member and emerge from the light-transmissive member through the face and/or side faces.

16 . The LED module according to claim 15 , wherein:

the submount has light diffusing properties.

17 . The LED module according to claim 15 , wherein

the submount has a planar size larger than a planar size of the LED chip.

18 . The LED module according to claim 15 , wherein

the surface of the opaque substrate has light diffusing properties.

19 . The LED module according to claim 15 , wherein

the surface of the opaque substrate has specular reflective properties.

20 . The LED module according to claim 15 , wherein

the opaque substrate functions as a heat sink.

21 . The LED module according to claim 15 , wherein

at least one of the first bond and the second bond contains a first fluorescent material which is excited by the light emitted from the LED chip to emit light having a different color from the light emitted from the chip.

22 . The LED module according to claim 21 , further comprising:

a color conversion portion made of a transparent material containing a second fluorescent material which is excited by the light emitted from the LED chip to emit light having a different color from the light emitted from the LED chip,

the color conversion portion covering sides of the LED chip and an opposite surface of the LED chip from the second bond.

23 . The LED module according to claim 22 , wherein

the color conversion portion contains a light diffusion material.

24 . The LED module according to claim 21 , further comprising a resin portion which is situated over the face of the submount and serves as an outer cover through which light passes last,

the resin portion being made of a transparent resin which contains a light diffusion material.

25 . The LED module according to claim 15 , wherein

the submount is constituted by a plurality of light-transmissive layers which are stacked in a thickness direction of the submount and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.

26 . The LED module according to claim 25 , wherein

each of the plurality of light-transmissive layers is a ceramic layer.

27 . A lighting device comprising:

a device main body; and

the LED module according to claim 15 which is held on the device main body.

28 . A lamp comprising:

a tube main body; and

a light source that is the LED module according to claim 15 .