Wireless module and production method for wireless module
Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.
1. A wireless module comprising:
a first substrate on which an antenna is mounted;
a second substrate which opposes the first substrate and on which an electronic component is mounted; and
a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic component,
wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a vertical direction with respect to mounting surfaces of the first substrate and the second substrate,
wherein in addition to the plurality of electric conductors, a third electric conductor having a diameter longer than diameters of the plurality of electric conductors is disposed between the first substrate and the second substrate, and
wherein the third electric conductor is disposed to contact the first substrate and the second substrate.
2. The wireless module according to claim 1 ,
wherein a molding compound is filled between the first substrate and the second substrate.
3. The wireless module according to claim 2 ,
wherein the molding compound comprises a first layer of molding compound filled on a second substrate side and a second layer of molding compound filled on a first substrate side, and
wherein a length of the first layer of molding compound in a thickness direction thereof is equal to or lower than a length of the electric conductor mounted on the second substrate in a thickness direction thereof.
4. The wireless module according to claim 2 ,
wherein the molding compound comprises a first layer of molding compound filled on a second substrate side and a second layer of molding compound filled on a first substrate side,
wherein a length of the first layer of molding compound in a thickness direction thereof is longer than a length of the electric conductor disposed inside the second substrate in a thickness direction thereof, and
wherein an opening through which the electric conductor is exposed is formed in the first layer of molding compound.
5. The wireless module according to claim 3 ,
wherein a material of the first layer of molding compound is different from a material of the second layer of molding compound.
6. The wireless module according to claim 1 ,
wherein a material of the first substrate is different from a material of the second substrate.
7. The wireless module according to claim 1 ,
wherein each of the plurality of electric conductors has conductivity and comprises a core section and a solder layer enclosing the core section.
8. The wireless module according to claim 7 ,
wherein diameters of the plurality of electric conductors are the same.
9. A wireless module, comprising:
a first substrate on which an antenna is mounted;
a second substrate which opposes the first substrate and on which an electronic component is mounted; and
a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic component,
wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a vertical direction with respect to mounting surfaces of the first substrate and the second substrate,
wherein the plurality of electric conductors have conductivity,
wherein a first electric conductor connected to the first substrate is an electric conductor having no material difference between a core section and a surrounding shell,
wherein a second electric conductor connected to the second substrate is an electric conductor having a material difference between a core section and a surrounding shell, and
wherein a diameter of the first electric conductor is shorter than a diameter of the second electric conductor.
10. The wireless module according to claim 1 ,
wherein the first substrate and the second substrate are partly covered with a resist, and
wherein lands are exposed from the resist at pad sections to which the plurality of electric conductors disposed on the first substrate and the second substrate are connected.