IP Library Patent Application 14389549
Patent Application
App. No. 14/389,549

PRINTING METHOD FOR PRINTING AND PLATING PROCESS

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Quick Facts
Patent No.
US None
App. No.
14/389,549
Abstract

A method for printing on a substrate, including providing a substrate having at least one three-dimensional surface and performing inkjet printing of an ink on at least a portion of the at least one three-dimensional surface by repositioning an inkjet printing head relative to the substrate in only two dimensions.

Claims (21)

1 . A method for printing on a substrate, comprising:

providing a substrate having at least one three-dimensional surface; and

performing inkjet printing of an ink on at least a portion of said at least one three-dimensional surface of said substrate by repositioning an inkjet printing head relative to said substrate in only two dimensions.

2 . A method for printing on a substrate according to claim 1 , and also comprising plating at least one conductive layer on the printed portion of said at least one three-dimensional surface of said substrate.

3 . A method for printing on a substrate according to claim 2 , wherein said conductive layer comprises a metal layer.

4 . A method for printing on a substrate according to claim 3 , wherein said metal layer comprises an antenna.

5 . A method for printing on a substrate according to claim 2 , wherein said at least one three-dimensional surface of said substrate includes a through-hole and said printed portion is formed on a bore of said through-hole.

6 . A method for printing on a substrate according to claim 2 , wherein said plating comprises electroplating.

7 . A method for printing on a substrate according to claim 2 , wherein said plating comprises electroless plating.

8 . A method for printing on a substrate according to claim 1 , wherein said substrate comprises a non-conductive substrate.

9 . A method for printing on a substrate according to claim 8 , wherein said non-conductive substrate comprises plastic.

10 . A method for printing on a substrate according to claim 1 , wherein said ink comprises a non-conductive ink.

11 . A method for printing on a substrate according to claim 1 , wherein said inkjet printing comprises piezoelectric inkjet printing.

12 . An antenna, comprising:

a substrate having at least one three-dimensional surface;

a pattern of ink printed on at least a portion of said three-dimensional surface by repositioning an inkjet printing head relative to said substrate in only two dimensions; and

at least one conductive layer plated on at least a portion of said pattern of ink.

13 . A method for printing on a bore of a through-hole, comprising:

providing a substrate having at least one through-hole formed therein having a bore; and

performing inkjet printing of an ink on at least a portion of said bore of said through-hole by repositioning an inkjet printing head relative to said substrate in only two dimensions.

14 . A method for printing on a bore of a through-hole according to claim 13 , and also comprising plating at least one conductive layer on the printed portion of said bore.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2019
From: GALTRONICS CORPORATION LTD.
To: CROWN CAPITAL PARTNER FUNDING, LP (FORMERLY, CROWN CAPITAL FUND IV, LP), BY ITS GENERAL PARTNER, CROWN CAPITAL PARTNER FUNDING INC.
Reel/Frame 048831/0243 →
SECURITY INTEREST Recorded Apr 11, 2018
From: GALTRONICS CORPORATION LTD.
To: CROWN CAPITAL FUND IV, LP
Reel/Frame 045920/0437 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2015
From: LEE, SANG-II; PARK, JUNG-SIC; ULMER, EPHRIAM; GUO, WEN-WEI
To: GALTRONICS CORPORATION LTD.
Reel/Frame 035024/0462 →