LED LIGHT EMITTING APPARATUS
The purpose of the present invention is to provide an LED light emitting apparatus, which has both the high reliability with respect to connection of the LED elements, and improved light extraction efficiency. This LED light emitting apparatus includes a mounting substrate having an element mounting region, in which a reflection layer is formed; a plurality of LED elements mounted in the element mounting region; a pair of facing electrodes, which have gold plating layers formed thereon, respectively, which are provided around the element mounting region, and which are connected to the LED elements by wire bonding; and a sealing frame, which is disposed around the element mounting region so as to cover the pair of facing electrodes. The inner circumference of the sealing frame is provided at a position where the inner circumference of the sealing frame covers the outer circumference of the reflection layer.
1 . An LED light emitting apparatus comprising:
a mounting substrate having a device mounting region in which a reflective layer is formed;
a plurality of LED devices mounted in said device mounting region;
a pair of opposing electrodes with a gold-plated layer formed thereon, said pair of opposing electrodes being arranged around said device mounting region and being connected to said plurality of LED devices by means of wire bonding; and
a sealing frame formed around said device mounting region so as to cover said pair of opposing electrodes,
wherein an inner circumference of said sealing frame overlaps an outer circumference of said reflective layer.
2 . The LED light emitting apparatus according to claim 1 , wherein said reflective layer is a metal plate that covers a bottom face exposed through an opening formed in a circuit substrate on which said pair of opposing electrodes is formed, and wherein said sealing frame is formed so as to cover a portion extending from an upper face of said circuit substrate to a side face of said opening and further to a surface of said metal plate.
3 . The LED light emitting apparatus according to claim 2 , wherein said metal plate is an aluminum plate.
4 . The LED light emitting apparatus according to claim 2 , wherein said reflective layer is an insulating film treated for high reflectivity formed on the surface of said metal plate.
5 . The LED light emitting apparatus according to claim 1 , wherein said reflective layer is a white reflective insulating layer formed on a circuit substrate on which said pair of opposing electrodes is formed, and wherein said sealing frame is formed so as to cover a portion extending from an upper face of said circuit substrate and overlapping the outer circumference of said white reflective layer.
6 . The LED light emitting apparatus according to claim 5 , wherein said white reflective layer is a ceramic ink layer or a white reflective resin layer.
7 . The LED light emitting apparatus according to claim 5 , wherein said white reflective layer is formed by depositing a silver-plated layer and a transparent insulating layer one on top of the other on said circuit substrate on which said pair of opposing electrodes is formed.
8 . The LED light emitting apparatus according to claim 1 , wherein said reflective layer formed in said device mounting region has a circular shape.
9 . The LED light emitting apparatus according to claim 1 , wherein said sealing frame is formed from a reflective white resin.
10 . The LED light emitting apparatus according to claim 1 , further comprising a phosphor layer, formed inside said sealing frame, for modulating light emitted from said plurality of LED devices and thereby converting said light into white light.
11 . The LED light emitting apparatus according to claim 10 , wherein said plurality of LED devices are blue LED devices, and said phosphor layer is a YAG phosphor layer.
12 . The LED light emitting apparatus according to claim 10 , wherein said plurality of LED devices are ultraviolet LED devices, and said phosphor layer is an RGB phosphor layer.
13 . The LED light emitting apparatus according to claim 1 , further comprising a resist layer intervening between said pair of opposing electrodes and said sealing frame and having openings at positions where said plurality of LED devices are connected to said opposing electrodes by means of wire bonding.
14 . The LED light emitting apparatus according to claim 3 , wherein said reflective layer is an insulating film treated for high reflectivity formed on the surface of said metal plate.