IP Library Granted Patent US 11,607,869
Granted Patent B2
US 11,607,869 · App. 14/391,240 · Granted Mar 21, 2023

Multilayer polymeric structure

Inventors: Charles C. Crabb (Royersford, PA); Thomas H. Richards (New Britain, PA); Steven B. Lacock (Perkiomenville, PA); Florence Mehlmann (Berwyn, PA)
Assignee: Trinseo Europe GmbH
B32B27/08B32B7/12B32B25/08B32B25/14B32B25/16B32B27/302B32B27/32B32B2250/03B32B2250/24B32B2250/246B32B2270/00B32B2274/00B32B2307/54B32B2307/554B32B2307/558B32B2307/71B32B2307/738B32B2325/00B32B2355/02B32B2509/00B32B2605/00B32B2605/003Y10T428/24967Y10T428/2967Y10T428/31913Y10T428/31917
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Quick Facts
Patent No.
US 11,607,869
App. No.
14/391,240
Granted
Mar 21, 2023
Kind
B2
Abstract

The invention relates to multilayer polymer structures having at least three layers. These layers include a polar capstock layer other than an acrylic, an olefinic substrate layer, and a tie layer. The tie layer is selected from olefinic acrylate copolymers, a block copolymer of vinyl aromatic monomer with an aliphatic conjugated diene or a derivative thereof, a copolymer of olefin and (meth)acrylic acid partially or fully in the salt form, a high impact polystyrene, and/or a vinyl cyanide-containing compound. Each layer could contain multiple sub-layers. The multilayer structure exhibits excellent structural integrity, excellent surface appearance, high impact strength, high scratch resistance, and excellent resistance to UV rays.

Claims (15)

1. A multi-layer thermoformable polymer structure or sheet comprising:

a) at least one thermoplastic polyolefin substrate layer,

b) at least one styrenic-based polymer capstock layer, having a thickness of from 0.075 to 2.5 mm, wherein said styrenic-based polymer is selected from the group consisting of polystyrene, high-impact polystyrene (HIPS), acrylonitrile-butadiene-styrene (ABS) copolymers, acrylonitrile-styrene-acrylate (ASA) copolymers, styrene acrylonitrile (SAN) copolymers, methacrylate-acrylonitrile-butadiene-styrene (MABS) copolymers, styrene-butadiene copolymers (SB), styrene-butadiene-styrene block (SBS) copolymers and their partially or fully hydrogenated derivatives, styrene-isoprene copolymers, styrene-isoprene-styrene (SIS) block copolymers and their partially or fully hydrogenated derivatives, and styrene-methyl methacrylate copolymers (S/MMA), and

c) a tie layer, having a thickness of from 0.05 to 1 mm, consisting of copolymers selected from the group consisting of olefinic acrylate copolymers having a homogeneous or heterogeneous distribution of compositions and molecular weights, copolymers of olefin and (meth)acrylic acid which can be partially or fully in the salt form, and mixtures thereof, wherein said tie layer has a tensile modulus of greater than 300 psi, as measured by ASTM D638,

wherein the tie layer is directly adjacent to, and in between the at least one polyolefin-based substrate layer and the at least one styrenic-based polymer layer,

wherein the layers a), b) and c) are coextruded together, and

wherein said at least one substrate layer is thicker than said at least one capstock layer and tie layer combined, and

wherein the thermoplastic polyolefin of the at least one substrate layer contains at least one polypropylene component and at least one elastomer component, where the at least one elastomer component includes at least one ethylene/alpha-olefin copolymer, at least one styrenic block copolymer, or a mixture thereof.

2. The multi-layer thermoformable structure of claim 1 , wherein said at least one styrenic-based polymer layer has a weight average molecular weight of between 50,000 and 500,000 g/mol, as measured by gel permeation chromatography.

3. The multi-layer thermoformable structure of claim 1 , wherein said at least one styrenic-based polymer comprises acrylonitrile-styrene-acrylate (ASA) copolymers.

4. The multi-layer thermoformable structure of claim 1 , wherein said at least one styrenic-based polymer layer further comprises one or more impact modifiers, fillers, and/or fibers.

5. The multi-layer thermoformable structure of claim 1 , wherein said tie layer has a tensile modulus of greater than 500 psi, as measured by ASTM D638.

6. An article formed from the thermoformable structure of claim 1 .

7. The article of claim 6 in the form of a flat sheet, a rod, or a profile.

8. The article of claim 6 formed by a process selected from lamination, coextrusion, multi-shot injection molding, and insert molding.

Assignments (4)
SECURITY INTEREST Recorded Jan 29, 2025
From: TRINSEO EUROPE GMBH
To: ALTER DOMUS (US) LLC
Reel/Frame 070048/0159 →
SECURITY INTEREST Recorded Jan 29, 2025
From: TRINSEO EUROPE GMBH
To: ALTER DOMUS (US) LLC
Reel/Frame 070048/0204 →
NUNC PRO TUNC ASSIGNMENT Recorded Jul 6, 2021
From: ARKEMA FRANCE
To: TRINSEO EUROPE GMBH
Reel/Frame 057368/0486 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2014
From: CRABB, CHARLES C.; RICHARDS, THOMAS H.; LACOCK, STEVEN B.; MEHLMANN, FLORENCE
To: ARKEMA FRANCE
Reel/Frame 033918/0450 →
Continuity (2)
Provisional Application 61623779 · Apr 13, 2012
Related Publication 20150111014A1 · Apr 23, 2015