Transponder layer and method for the production thereof
The invention relates to a transponder layer ( 10 ), in particular for producing a chip card, having an antenna substrate ( 12 ), which, on an antenna side ( 11 ), is equipped with an antenna ( 14 ) formed from a wire conductor ( 13 ), and has a chip accommodation which is formed by a recess in the antenna substrate and in which a chip ( 21 ) is accommodated, wherein wire conductor ends, which serve to form terminal ends ( 15 ) of the antenna, are formed at a bottom ( 20 ) of the chip accommodation which is recessed with respect to the rear side ( 26 ) of the antenna substrate ( 12 ), and the chip is accommodated in the chip accommodation in such a manner that terminal contacts ( 22 ) arranged on a contact side ( 36 ) of the chip are contacted with flat contact portions ( 19 ) of the terminal ends ( 15 ), and the chip is arranged with the rear side ( 27 ) of its semiconductor body ( 28 ) facing the terminal contacts substantially flush with the rear side of the antenna substrate. Furthermore, the invention relates to a method for producing a transponder layer.
1. A method for producing a transponder layer for use in a multi-layer laminated chip card, the transponder layer comprising an antenna substrate including a wire conductor having a substantially round cross-section embedded with a portion of its cross-section in an elongate layer of plastic and the remaining portion of the wire conductor cross-section protruding from the elongate layer of plastic, wherein the antenna substrate comprises a first side comprising a plastic surface, and a second side including a protruding metal conductor, said method comprising:
removing plastic from the first side of the antenna substrate to form a chip accommodation window sized and dimensioned to receive a package-less chip, the chip accommodation window exposing portions of the metal conductor to the first side of the antenna substrate, wherein flat contact portions are formed in the exposed portions of the wire conductor in the chip accommodation area;
positioning the chip accommodation window adjacent a mounting plate;
inserting a package-less chip in the chip accommodation window with a surface of the package-less chip including terminal contacts contacting the exposed portions of the metal conductor in the chip accommodation window;
heating the wire conductor; and
applying pressure to the package-less chip from the first side of the plastic substrate, wherein the terminal contacts of the chip directly contact the flat contact portions of the wire conductor, and the chip is accommodated in the antenna substrate with the side of semiconductor body opposite the surface including terminal contacts flush with the first side of the antenna substrate.
2. The method according to claim 1 , wherein the terminal contacts include contact elevations of a conductive adhesive, and further comprising the step of applying pressure to the terminal ends to contact the terminal contacts of the chip with the flat contact portions.
3. The method of claim 1 , further comprising the step of forming the flat contact portions of the terminal ends at the bottom of the window.
4. The method of claim 1 , further comprising the step of forming a three layer laminate chip card by arranging the transponder layer as an intermediate layer between a lower cover layer and an upper cover layer in a layer composite, wherein the lower cover layer is arranged on the antenna side of the antenna substrate and the upper cover layer is arranged both on the rear side of the antenna substrate and on the rear side of the semiconductor body of the chip.
5. The method of claim 4 , wherein the lower external layer of the chip card is formed by the lower cover layer of the card inlay and an upper external layer of the chip card is formed by the upper cover layer of the card inlay.