Socket with routed contacts
A socket ( 130 ) employs a substrate ( 310 ) including a conductive network. As array of first contacts ( 136 ) is on a top surface of the substrate ( 310 ) and arranged to engage an integrated circuit ( 110 ). An array of second contacts ( 138 ) is on a bottom surface of the substrate ( 310 ) and arranged to engage a circuit board ( 120 ). The conductive network electrically connects the first contacts ( 136 ) respectively to the second contacts ( 138 ), and the first contacts ( 136 ) include a roused first contact ( 136 ′) that the conductive network routes horizontally in or on the substrate ( 310 ).
1. A socket comprising:
a substrate including an insulating material and a conductive network;
an array of first contacts on a top surface of the substrate and arranged to engage an integrated circuit;
an array of second contacts on a bottom surface of the substrate and arranged to engage a circuit board,
an array of third contacts on a too surface of the substrate and arranged to engage conductive media; and
a flex connector comprising a flexible cable connected to the third contacts; wherein:
the conductive network electrically connects the first contacts respectively to the second contacts; and
the first contacts include a routed first contact that the conductive network routes horizontally in or on the substrate.
2. The socket of claim 1 , wherein the conductive network comprises:
a conductive via that extends vertically in the substrate and is horizontally offset from the routed first contact; and
top traces that are on the top surface of the substrate and connect the routed first contact to the conductive via.
3. The socket of claim 1 , wherein the first contacts or the second contacts are spring contacts and compress in response to the integrated circuit engaging an interposer.
4. The socket of claim 1 , wherein the first contacts include an unrouted first contact that the conductive network directly routes vertically to an unrouted second contact among the second contacts.
5. The socket of claim 1 , wherein the network connects the routed first contact to a routed second contact that is one of the second contacts and is horizontally offset from the routed first contact.
6. The socket of claim 5 , wherein the conductive network comprises:
a conductive via that extends vertically in the substrate and is horizontally offset from the routed second contact; and
bottom traces that are on the bottom surface of the substrate and connect the routed second contact to the conductive via.
7. The socket of claim 5 , wherein the conductive network comprises:
a first conductive via that extends vertically in the substrate and is electrically connected to the routed first contacts;
a second conductive via that is horizontally offset from the first conductive via, extends vertically in the substrate, and is electrically connected to the routed second contact; and
internal traces that electrically connect the first conductive via and the second conductive via inside the substrate.
8. A socket, comprising:
a substrate including an insulating material and a conductive network;
an array of first contacts on a top surface of the substrate and arranged to engage an integrated circuit;
an array of second contacts on a bottom surface of the substrate and arranged to engage a circuit board; and
an auxiliary chip that is mounted on the substrate, and accessible through the first contacts or second contacts; wherein:
the conductive network electrically connects the first contacts respectively to the second contacts;
the first contacts include a routed first contact that the conductive network routes horizontally in or on the substrate; and
the auxiliary chip is aligned for communication via optical signals passing through a void in the circuit board.
9. The socket of claim 8 , wherein the auxiliary chip stores configuration information.
10. The socket of claim 8 , wherein the auxiliary chip comprises electrical-optical signal converters.