Soldering apparatus and manufacturing method of soldered product
An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece.
1. A soldering apparatus, comprising:
a thermal radiation heater configured to heat a workpiece to be soldered by thermal radiation; and
two coolers configured to cool by thermal conduction the workpiece soldered, the coolers being arranged to sandwich the thermal radiation heater therebetween, movable between a standby position and a cooling position, and formed with a recessed portion, the recessed portion configured to dispose therein the thermal radiation heater sandwiched between the two coolers;
wherein the coolers are configured to be moved to the standby position where the coolers are separated from the workpiece and stand by such that the thermal radiation heater is in a state of protruding from the recessed portion, the state of protruding being due to the moving, while the thermal radiation heater heats the workpiece, and the coolers are configured to be moved from the standby position to the cooling position to cool the workpiece in which the coolers are in contact with the workpiece.
2. The soldering apparatus according to claim 1 , further comprising:
thermal blocking means for blocking radiation heat from the thermal radiation heater, the thermal blocking means being formed between the thermal radiation heater and the coolers.
3. The soldering apparatus according to claim 1 ,
comprising a plurality of thermal radiation heaters, each of the thermal radiation heaters being sandwiched between the two coolers,
wherein each of the coolers is formed of a cooling plate, the thermal radiation heaters and the coolers are alternately arranged so as to be along a surface to be heated of the workpiece.
4. The soldering apparatus according to claim 1 , further comprising:
an airtight chamber configured to airtightly surround the thermal radiation heater and the coolers.
5. The soldering apparatus according to claim 1 , further comprising:
a guide post configured to guide a movement of the coolers;
a cooling base portion, the coolers being integrally connected thereto; and
a refrigerant supply device configured to supply a refrigerant to cool the cooler,
wherein a refrigerant flow path is formed inside the cooling base portion and the guide post, the refrigerant flow path being for circulating the refrigerant in the cooling base portion through the guide post to cool the coolers.
6. The soldering apparatus according to claim 1 , further comprising:
a radiation thermometer configured to measure a radiation temperature of the workpiece; and
a control device configured to control a heating of the workpiece by the thermal radiation heater and a cooling of the workpiece by the coolers based on the radiation temperature of the workpiece measured by the radiation thermometer.
7. The soldering apparatus according to claim 1 , further comprising:
a secondary cooling device configured to further cool the workpiece after a cooling by the coolers.
8. A manufacturing method of a soldered product, comprising:
a step of loading a workpiece to be soldered on the soldering apparatus according to claim 1 ; and
a step of soldering the workpiece by using the soldering apparatus.