Method for producing a multi-layered structural element, and a multi-layered structural element produced according to said method
A multi-layered structural element and a method for producing a multi-layered structural element are disclosed. In an embodiment dielectric green sheets, at least one ply containing an auxiliary material which contains at least one copper oxide and layers containing electrode material are provided and arranged alternately one above another. These materials are debindered and sintered. The copper oxide is reduced to form the copper metal and the at least one ply is degraded during debindering and sintering.
1. A method for producing a multi-layered structural element, the method comprising:
providing an electrode material comprising copper and green sheets containing a dielectric material;
providing an auxiliary material containing at least one copper oxide;
forming a stack comprising the dielectric green sheets, at least one ply containing the auxiliary material and layers containing the electrode material arranged alternately one above another; and
debindering and sintering the stack comprising diffusing and reducing the at least one copper oxide of the at least one ply so that copper ions diffuse from the auxiliary material to adjacent electrode layers thereby forming the multi-layered structural element comprising at least one weakening layer and dielectric ceramic layers with internal electrode layers arranged between them, the internal electrode layers consisting essentially of a metal comprising copper,
wherein the weakening layer has a reduced fracture strength compared to the dielectric ceramic layers, and
wherein a concentration of the copper in the electrode material is present in a smaller proportion than a concentration of copper in the auxiliary material, the copper in the auxiliary material being part of the at least one copper oxide.
2. The method according to claim 1 , wherein debindering and sintering comprises applying oxygen partial pressure thereby reducing the at least one copper oxide to a copper metal.
3. The method according to claim 2 , wherein reducing the at least one copper oxide to the copper metal is concluded after debindering.
4. The method according to claim 1 , wherein the copper oxide is CuO.
5. The method according to claim 1 , wherein the copper oxide is Cu 2 O.
6. The method according to claim 1 , wherein the auxiliary material consists of one component.
7. The method according to claim 1 , wherein the dielectric material is a piezoelectric material.
8. A method for producing a multi-layered structural element, the method comprising:
providing green sheets comprising a dielectric material;
providing an electrode material comprising copper on some of the green sheets;
providing plies, each ply comprising an auxiliary material containing at least one copper oxide;
forming a stack comprising the dielectric green sheets and a ply between adjacent green sheets with the electrode material; and
debindering and sintering the stack comprising reducing and diffusing the at least one copper oxide of the plies so that copper ions diffuse from the auxiliary material to the adjacent electrode material thereby forming the multi-layered structural element comprising electrode layers formed from the electrode material, weakening layers formed from the plies and dielectric ceramic layers formed from the green sheets, the electrode layers comprising a copper metal,
wherein the weakening layers have a reduced fracture strength compared to the dielectric ceramic layers, and
wherein a concentration of the copper in the electrode material is present in a smaller proportion than a concentration of copper in the auxiliary material, the copper in the auxiliary material being part of the at least one copper oxide.
9. The method according to claim 8 , wherein the at least one copper oxide is CuO.
10. The method according to claim 8 , wherein the at least one copper oxide is Cu 2 O.
11. The method according to claim 8 , wherein the at least one copper oxide consists of CuO.
12. The method according to claim 8 , wherein the at least one copper oxide consists of Cu 2 O.
13. The method according to claim 8 , wherein the dielectric ceramic layers comprise lead zirconate titanate (PZT), and wherein the lead zirconate titanate (PZT) is Pb(Zr x Ti 1-x )O 3 , where o≤x≤1.
14. The method according to claim 8 , wherein the dielectric ceramic layers comprise a lead free ceramic.
15. The method according to claim 8 , wherein the electrode material comprises a CuPd paste.
16. The method according to claim 8 , wherein the weakening layers are porous layers.
17. The method according to claim 8 , wherein debindering comprises debindering at a temperature between 500° C. and 600° C.
18. The method according to claim 17 , wherein sintering comprises sintering at a temperature of 1010° C.
19. The method according to claim 18 , further comprising forming external electrodes on opposite faces of the stack after sintering, wherein forming the external electrodes comprises applying a metal paste comprising copper or silver on opposite faces of the stack and firing the metal paste.