Aperture plate for a nebulizer
A photo-resist ( 21 ) is applied in a pattern of vertical columns having the dimensions of holes or pores of the aperture plate to be produced. This mask pattern provides the apertures which define the aerosol particle size, having up to 2500 holes per square mm. There is electro-deposition of metal ( 22 ) into the spaces around the columns ( 21 ). There is further application of a second photo-resist mask ( 25 ) of much larger (wider and taller) columns, encompassing the area of a number of first columns ( 21 ). The hole diameter in the second plating layer is chosen according to a desired flow rate.
1. An aperture plate wafer comprising:
a bottom layer of photolithography-plated metal with aerosol-forming through holes; and
at least one top layer of photolithography-plated metal having spaces, in which said spaces overlie a plurality of the aerosol-forming through holes, wherein the at least one top layer directly contacts the bottom layer so as to completely occlude and inter-fill some of the aerosol-forming through holes in the bottom layer wherein the aperture plate wafer is dome-shaped.
2. The aperture plate wafer as claimed in claim 1 , wherein the photolithography-plated metal of the bottom layer is the same as the photolithography-plated metal of the at least one top layer.
3. The aperture plate wafer as claimed in claim 1 , wherein the plated metal of the bottom layer and the at least one top layer includes at least one of Ni or Pd.
4. The aperture plate wafer as claimed in claim 3 , wherein the plated metal of the bottom layer and the at least one top layer includes anti-corrosion properties.
5. The aperture plate wafer as claimed in claim 4 , wherein the proportion of Pd is in the range of 85% w/w and 93% w/w, and, substantially the balance being Ni.
6. The aperture plate wafer as claimed in claim 1 , wherein the plated metal includes at least one of Ag or Cu at a surface, and includes anti-bacterial properties.
7. The aperture plate as claimed in claim 1 , wherein the aperture plate is formed as a wafer.
8. The aperture plate wafer as claimed in claim 1 , wherein the aerosol-forming through holes have a width dimension in the range of 1 μm to 10 μm.
9. The aperture plate wafer as claimed in claim 8 , wherein the aerosol-forming through holes have a width dimension in the range of 2 μm to 6 μm.
10. The aperture plate wafer as claimed in claim 1 , wherein the wafer thickness is in the range of 45 μm to 90 μm.
11. The aperture plate wafer as claimed in claim 10 , wherein the wafer thickness is above 50 μm.
12. An aperture plate, comprising:
a bottom layer of photolithography-plated metal with aerosol-forming through holes, wherein each aerosol-forming through hole of the bottom layer has a hole-width dimension in the range of 1 μm to 10 μm; and
at least one top layer of photolithography-plated metal occluding and inter-filling some of the aerosol-forming through holes of the bottom layer so as to mechanically anchor the at least one top layer with the bottom layer, the at least one top layer having spaces, wherein the spaces of the at least one top layer have a space-width dimension in the range of 20 μm to 400 μm;
wherein a combined height of the bottom layer and the at least one top layer is in the range of 45 μm and 90 μm;
wherein a first space of the spaces of the at least one top layer directly overlies a first plurality of the plurality of aerosol-forming through holes of the bottom layer;
wherein the aperture plate is dome-shaped.
13. The aperture plate as claimed in claim 12 , wherein the hole-width dimension is in the range of 2 μm to 6 μm.
14. The aperture plate as claimed in claim 12 , wherein the space-width dimension is in the range of 20 μm to 400 μm.
15. The aperture plate as claimed in claim 12 , wherein the plated metal of the bottom layer and the at least one top layer includes Ni and/or Pd.
16. The aperture plate as claimed in claim 15 , wherein the Ni and/or Pd are present at a surface at a concentration chosen for anti-corrosion properties.
17. An aerosol-forming device, comprising:
a dome-shaped aperture plate including:
a bottom layer of photolithography-plated metal with aerosol-forming through holes, and
at least one top layer of photolithography-plated metal completely occluding and at least partially inter-filling some of the aerosol-forming through holes of the bottom layer so as to mechanically anchor the at least one top layer with the bottom layer and to tune a flow rate of material passing through the dome-shaped aperture plate, the at least one top layer having spaces;
wherein a central longitudinal axis of each of a first plurality of the plurality of aerosol-forming through holes extends through a first space of the spaces of the at least one top layer.
18. The aerosol-forming device as claimed in claim 17 , wherein the plated metal of the bottom layer and the at least one top layer includes Ni and/or Pd.
19. The aerosol-forming device as claimed in claim 17 , further including a drive engaging the aperture plate to vibrate the aperture plate at a desired frequency for forming an aerosol.
20. The aerosol-forming device as claimed in claim 17 , further including a support for the aperture plate for passive aperture plate use, and a horn arranged to force a wave of liquid through the aperture plate.