IP Library Granted Patent US 9,651,821
Granted Patent B2
US 9,651,821 · App. 14/401,920 · Granted May 16, 2017

Surface-modified metal oxide particle material, dispersion liquid, silicone resin composition, silicone resin composite body, optical semiconductor light emitting device, lighting device, and liquid crystal imaging device

Inventors: Yoichi Sato (Tokyo, JP); Yasuyuki Kurino (Tokyo, JP); Takeshi Otsuka (Tokyo, JP); Takeru Yamaguchi (Tokyo, JP); Kenji Harada (Tokyo, JP)
Assignee: Sumitomo Osaka Cement Co., Ltd.
G02F1/1336C08G77/20C08G77/80C08K5/56C08K9/06C08L83/04C09D183/04H01L33/56C08G77/12C08K2003/2244C08K2201/008C08K2201/011Y10T428/2982
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Quick Facts
Patent No.
US 9,651,821
App. No.
14/401,920
Granted
May 16, 2017
Kind
B2
Abstract

By using a surface-modified metal oxide particle material obtained by performing surface modification on a metal oxide particle having an average primary particle diameter of 3 nm or more and 10 nm or less with a surface-modifying material having at least a phenyl group and a group capable of undergoing a crosslinking reaction with a functional group in a silicone resin-forming component, the surface-modified metal oxide particle material which has high heat resistance and may further exhibit high transparency and gas barrier properties when used for a sealing material for optical semiconductor light emitting device, or the like is provided and a dispersion liquid, a silicone resin composition and a silicone resin composite each containing the surface-modified metal oxide particle material, as well as an optical semiconductor light emitting device, a light fitting, and a liquid crystal imaging device each using the silicone resin composite, are also provided.

Claims (15)

1. A surface-modified metal oxide particle material obtained by performing surface modification on a metal oxide particle having an average primary particle diameter of 3 nm or more and 10 nm or less with a surface-modifying material having at least a phenyl group and a group capable of undergoing a crosslinking reaction with a functional group in a silicone resin-forming component,

wherein the group capable of undergoing a crosslinking reaction with a functional group in a silicone resin-forming component is a hydrogen atom,

wherein the surface-modifying material is a combination of a surface-modifying material containing a phenyl group and a surface-modifying material containing a hydrogen atom,

the surface-modifying material containing a phenyl group is one or more kinds selected from the materials having a structure represented by the following formulae (1), (2) and silicone materials having a resin structure (three-dimensional network structure) containing a phenyl group and an alkoxy group,

(C 6 H 5 ) n SiX 4−n   formula (1):

wherein, n is an integer of from 1 to 3, X is selected from a methoxy group, an ethoxy group, a hydroxyl group, a halogen atom, and a carboxy group; and when (4−n) is 2 or more, each X may be the same as or different from every other X, formula (2):

wherein a is an integer of from 1 to 100; b is an integer of from 0 to 100; and c is an integer of from 1 to 3; and wherein each of A, B, C and D is one or two or more members selected from the group consisting of a phenyl group and an alkyl group having from 1 to 6 carbon atoms, and at least any one of A and B is a phenyl group; and wherein all of A, B, C, and D may be a phenyl group; and wherein each of the sites constituted of Si.A.B.O and the sites constituted of Si.C.D.O is arbitrary with respect to the position and arrangement and is of a random polymer type; and wherein X is selected from the group consisting of a methoxy group, an ethoxy group, a hydroxyl group, a halogen atom, and a carboxy group, and when c is 2 or more, each X may be the same of different from every other X, and the surface-modifying material containing a hydrogen group is one or more kinds selected from the group consisting of triethoxysilane, dimethylethoxysilane, diethoxymethylsilane, dimethylchlorosilane and ethyldichlorosilane.

2. A dispersion liquid including the surface-modified metal oxide particle material according to claim 1 .

3. A silicone resin composition including the surface-modified metal oxide particle material according to claim 1 and a silicone resin-forming component containing at least one member from the group consisting of phenyl silicone resin-forming component and a methyl phenyl silicone resin-forming component, the silicone resin-forming component having at least one member selected from the group consisting of an alkenyl group and an alkynyl group.

4. The silicone resin composition according to claim 3 , wherein the metal oxide particle is contained in an amount of 5% by mass or more.

5. The silicone resin composition according to claim 3 , further including a hydrosilylation catalyst.

6. A silicone resin composite obtained by curing the silicone resin composition according to claim 3 .

7. An optical semiconductor light emitting device comprising a semiconductor light emitting element sealed with a sealing material, wherein the sealing material is composed of the silicone resin composite according to claim 6 , and a sealing layer made of the sealing material has a thickness of 50 μm or more.

8. A light fitting comprising the optical semiconductor light emitting device according to claim 7 .

9. A liquid crystal imaging device comprising the optical semiconductor light emitting device according to claim 7 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2014
From: SATO, YOICHI; KURINO, YASUYUKI; OTSUKA, TAKESHI; YAMAGUCHI, TAKERU; HARADA, KENJI
To: SUMITOMO OSAKA CEMENT CO., LTD.
Reel/Frame 034197/0629 →
Priority Claims (4)
JP 2012-114897 · May 18, 2012 · national
JP 2013-074730 · Mar 29, 2013 · national
JP 2013-105419 · May 17, 2013 · national
JP 2013-105433 · May 17, 2013 · national
Continuity (1)
Related Publication 20150274894A1 · Oct 1, 2015