Light extraction using feature size and shape control in LED surface roughening
View Patent ↗The structural characteristics of the light-exiting surface of a light emitting device ( 200 ) are controlled so as to increase the light extraction efficiency of that surface ( 225 ) when the surface is roughened. A light emitting surface ( 225 ) comprising layers of materials with different durability to the roughening process exhibits a higher light extraction efficiency than a substantially uniform light emitting surface exposed to the same roughening process. In a GaN-type light emitting device ( 200 ), a thin layer ( 240 ) of AlGaN material on or near the light-exiting surface ( 225 ) creates sharper features after etching compared to the features created by conventional etching of a surface comprising only GaN material.
1. A method, comprising:
forming a structure that includes an undoped starter layer, an undoped template layer grown on the undoped starter layer, a first conductive semiconductor layer grown on the undoped template layer, an active layer grown on the first conductive semiconductor layer, and a second conductive semiconductor layer grown on the active layer, wherein the undoped starter layer, the undoped template layer, and the first conductive semiconductor layer have planar surfaces devoid of islanding growth;
etching the structure using a first etching process to remove the undoped starter layer and expose the undoped template layer; and
etching the structure using a second etching process different from the first etching process to create features that extend into the undoped template layer and the first conductive semiconductor layer, wherein the undoped template layer and the first conductive semiconductor layer having different material characteristics in that the undoped template layer is more durable to the second etching process than the first conductive semiconductor layer.
2. The method of claim 1 , wherein the undoped starter layer comprises AlN, the undoped template layer comprises AlGaN, and the first conductive semiconductor layer comprises doped GaN.
3. The method of claim 2 , wherein the undoped template layer comprises Al x Ga 1-x N, where x is between 0.3 and 0.8.
4. The method of claim 1 , wherein etching the structure using the second etching process includes photochemical etching, wherein etching includes including filtering a spectrum of a lamp used for the photochemical etching to increase an etch rate of the first conductive semiconductor layer relative to an etch rate of the undoped template layer to increase sharpness.