IP Library Granted Patent US 10,361,018
Granted Patent B2
US 10,361,018 · App. 14/407,919 · Granted Jul 23, 2019

Method for producing a multi-layer component and multi-layer component

Inventors: Franz Rinner (Deutschlandsberg, AT); Dieter Somitsch (Gross St. Florian, AT); Christoph Auer (Graz, AT); Gerhard Fuchs (Steinerkirchen, AT)
Assignee: EPCOS AG
H01C7/008C25F3/00H01C1/14H01C7/10H01C7/18H01C17/006H01C17/28H01G4/005H01G4/012H01G4/30H01L41/0471H01L41/0838H01L41/297
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Quick Facts
Patent No.
US 10,361,018
App. No.
14/407,919
Granted
Jul 23, 2019
Kind
B2
Abstract

A method for producing a multilayer component ( 21 ) is specified, which involves providing a body having dielectric layers ( 3 ) arranged one above another and first and second electrically conductive layers ( 4, 84, 5, 85 ) arranged therebetween. The first conductive layers ( 4, 84 ) are connected to a first auxiliary electrode ( 6 ) and the second conductive layers ( 5, 85 ) are connected to a second auxiliary electrode ( 7 ). The body ( 1, 81 ) is introduced into a medium and a voltage is applied between the first and second auxiliary electrodes ( 6, 7 ) for producing a material removal. Furthermore, a multilayer component is specified, which has depressions ( 20 ) formed by an electrochemically controlled material removal.

Claims (23)

1. A method for producing a multilayer component comprising the following steps:

A) providing a body having dielectric layers arranged one above another and first and second electrically conductive layers alternatingly arranged therebetween,

wherein the first conductive layers are connected to a first auxiliary electrode and the second conductive layers are connected to a second auxiliary electrode; and

B) introducing at least one part of the body into a medium and applying a voltage between the first and second auxiliary electrodes in order to produce a material removal from at least one of the first and second electrically conductive layers,

wherein the material removal is a single-stage etching process,

wherein in the single-stage etching process, depressions are introduced at two side surfaces of the body, and

wherein the first conductive layers are completely removed in the single-stage etching process.

2. The method according to claim 1 , wherein applying the voltage effects a material transport between the first and second electrically conductive layers.

3. The method according to claim 1 , wherein at least one of the electrically conductive layers is etched in an electrically controlled manner or coated in an electrically controlled manner by applying a voltage.

4. The method according to claim 1 , wherein in step B) a third auxiliary electrode is introduced into the medium.

5. The method according to claim 1 , wherein the body is sintered before being introduced into the medium.

6. The method according to claim 1 , wherein at least the first conductive layer contains copper.

7. The method according to claim 1 , wherein the medium comprises iron (III) chloride, sodium persulfate or copper chloride.

8. The method according to claim 1 , wherein, in at least one stage of the material removal, a positive potential is applied to the first auxiliary electrode and a negative potential is applied to the second auxiliary electrode.

9. The method according to claim 1 , wherein the first and second conductive layers in the multilayer component serve as electrodes.

10. The method according to claim 1 , wherein the first conductive layers in the multilayer component have no function as electrodes.

11. The method according to claim 1 , wherein the body has third conductive layers, which are connected to the second auxiliary electrode, and

wherein the third conductive layers have a different geometry than the second conductive layers.

12. The method according to claim 11 , wherein the second and third conductive layers in the multilayer component serve as electrodes.

13. The method according to claim 1 , comprising the following further step:

C) removing the auxiliary electrodes.

14. The method according to claim 1 , comprising the following further step:

D) separating the body into a plurality of main bodies for multilayer components.

Assignments (2)
CHANGE OF NAME Recorded Mar 17, 2023
From: EPCOS AG
To: TDK ELECTRONICS AG
Reel/Frame 063117/0209 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2015
From: RINNER, FRANZ, DR.; SOMITSCH, DIETER, DR.; AUER, CHRISTOPH, DR.; FUCHS, GERHARD
To: EPCOS AG
Reel/Frame 035694/0658 →
Priority Claims (1)
DE 10 2012 105 059 · Jun 12, 2012 · national
Continuity (1)
Related Publication 20150123516A1 · May 7, 2015