Semiconductor apparatus
View Patent ↗The semiconductor apparatus includes: the first lead frame; the second lead frame; the second insulation resin which is disposed between the first lead frame and the second lead frame; the sealing resin which seals the semiconductor elements, the first lead frame and the second lead frame; the electric wiring part which electrically connects the semiconductor elements and the first lead frame; and the interlayer connecting part which electrically connects the first lead frame and the second lead frame.
1. A semiconductor apparatus comprising:
a first lead frame which is equipped with first and second semiconductor elements;
a second lead frame which is disposed in parallel with the first lead frame;
a second insulation resin which is disposed between the first lead frame and the second lead frame;
a sealing resin which seals the first and second semiconductor elements, the first lead frame and the second lead frame;
an electric wiring part which electrically connects the first lead frame with the first and second semiconductor elements;
an interlayer connecting part which electrically connects the first lead frame and the second lead frame;
a heat radiating plate which is disposed in parallel with the second lead frame; and
a first insulation resin which is disposed between the second lead frame and the heat radiating plate, wherein
the sealing resin seals the heat radiating plate,
the first lead frame has: a first island-shaped part which is equipped with the first semiconductor element; a second island-shaped part which has an output electrode, and is equipped with the second semiconductor element; and a third island-shaped part which has one of a positive-electrode side outer part electrode and a negative-electrode side outer part electrode,
the second lead frame has another of the positive-electrode side outer part electrode and the negative-electrode side outer part electrode,
the electric wiring part electrically connects the first semiconductor element and the second island-shaped part, and electrically connects the second semiconductor element and the third island-shaped part, and
the interlayer connecting part electrically connects the first island-shaped part and the second lead frame.
2. The semiconductor apparatus according to claim 1 , wherein
a distance between the first lead frame and the second lead frame is equal to or more than 50 μm and equal to or less than 500 μm.
3. The semiconductor apparatus according to claim 1 , wherein
the first island-shaped part has a shape of a rectangle,
a main body part of the second island-shaped part, except for the output electrode, has a shape of a rectangle,
a main body part of the third island-shaped part, except for the one of the positive-electrode side outer part electrode and the negative-electrode side outer part electrode, has a shape of a rectangle,
a main body part of the second lead frame, except for the another of the positive-electrode side outer part electrode and the negative-electrode side outer part electrode, has a shape of a rectangle,
a center line of the first island-shaped part, a center line of the main body part of the second island-shaped part, a center line of the main body part of the third island-shaped part, a center line of the main body part of the second lead frame, a center line of the electric wiring part and a center line of the interlayer connecting part are disposed on a same line, and
center points of the first and second semiconductor elements are disposed on the same line.
4. The semiconductor apparatus according to claim 1 , wherein
the electric wiring part has a shape of a flat plate being bent,
a main body part of the second island-shaped part, except for the output electrode, has a shape of a rectangle,
a main body part of the third island-shaped part, except for the one of the positive-electrode side outer part electrode and the negative-electrode side outer part electrode, has a shape of a rectangle, and
equal are a width of the main body part of the second island-shaped part in a direction orthogonal to an electric current direction, a width of the main body part of the third island-shaped part in a direction orthogonal to an electric current direction, and a width of a portion of the electric wiring part, which is electrically connected with the second and third island-shaped parts, in a direction orthogonal to an electric current direction.
5. The semiconductor apparatus according to claim 1 , wherein
the interlayer connecting part has a shape of a flat plate being bent,
the first island-shaped part has a shape of a rectangle, and
equal are a width of the first island-shaped part in a direction orthogonal to an electric current direction, and a width of a portion of the interlayer connecting part, which is electrically connected with the first island-shaped part, in a direction orthogonal to an electric current direction.
6. The semiconductor apparatus according to claim 1 , being a semiconductor apparatus which is utilized for an electric power converting apparatus for a 3-phase motor, wherein
the output electrode is an electrode which is connected to one of U phase, V phase and W phase electrodes of the 3-phase motor.