Electrical component and method of producing electrical components

1. An electrical component comprising:

a closed lead frame with a passage opening;

at least one electrical component arranged within the passage opening, the electrical component comprising a first contact pad on one side of the electrical component and a second contact pad on a second side of the electrical component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and

an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame comprises a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

2. The electrical component of claim 1 , wherein the lead frame comprises at least one anchoring structure configured such that the encapsulation is anchored to the lead frame.

3. The electrical component of claim 1 , which is an opto-electrical component, a light-emitting component, or a light-emitting diode, and the encapsulation is transparent to the electro-magnetic radiation.

4. The electrical component of claim 3 , wherein the encapsulation forms a lens for the opto-electrical component.

5. The electrical component of claim 1 , wherein the encapsulation is a mold material.

6. A method of producing an electrical component comprising:

providing a carrier sheet;

depositing a closed lead frame on the carrier sheet, the lead frame comprising a passage opening;

placing at least one component into the passage opening of the lead frame, a first contact pad of the component being brought into contact with the carrier sheet;

electrically coupling a second contact pad of the component to the lead frame;

depositing an encapsulation on the electrical component and on the lead frame, the encapsulation mechanically coupling the electrical component to the lead frame; and

removing the carrier sheet,

wherein the lead frame comprises a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

7. The method of claim 6 , wherein the second contact pad of the component is electrically coupled to the lead frame by wire bonding.

8. The method of claim 6 , wherein the lead frame comprises at least one anchoring structure configured such that the encapsulation is anchored to the lead frame.

9. The method of claim 6 , wherein the lead frame is part of a lead-frame arrangement being arranged on the carrier sheet, and

wherein the lead frames with the components are singularized after removing the carrier sheet.

10. The method of claim 6 , wherein the encapsulation is a mold material.

11. An electrical component comprising:

a closed lead frame with a passage opening;

at least one electrical component arranged within the passage opening, the electrical component comprising a first contact pad on one side of the electrical component and a second contact pad on a second side of the electrical component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and

an encapsulation which mechanically couples the electrical component to the lead frame;

wherein the lead frame comprises at least one anchoring structure configured such that the encapsulation is anchored to the lead frame.

12. The electrical component of claim 11 , wherein the lead frame comprises a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connects at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

13. The electrical component of claim 11 , which is an opto-electrical component, a light-emitting component, or a light-emitting diode, and the encapsulation is transparent to the electro-magnetic radiation.

14. The electrical component of claim 13 , wherein the encapsulation forms a lens for the opto-electrical component.

15. The electrical component of claim 11 , wherein the encapsulation is a mold material.