Production method for joined body

1. A method of manufacturing a joined body, comprising:

covering a first area and a second area of a first substrate with a sheet of resin containing ultraviolet curable resin in an uncured state;

separating a part of the sheet covering the second area from the first substrate, the separating performed after the covering; and

joining the first substrate with a second substrate by arranging the second substrate to face the first substrate with a part of the sheet covering the first area between the first substrate and the second substrate, and curing the resin in the part of the sheet covering the first area, the joining performed after the separating, wherein

during the separating, a phase difference δ between stress and strain in the part of the sheet covering the second area is between 35 degrees and 48 degrees, inclusive, and a temperature of the part of the sheet covering the second area is between 25 degrees Celsius and 60 degrees Celsius, inclusive,

the separating is performed by peeling the part of the sheet covering the second area from the first substrate by exerting mechanical stress on the sheet, and

in the separating, at least the part of the sheet covering the second area is in the uncured state.

2. The method of claim 1 , wherein

before the separating, the phase difference δ between stress and strain in the part of the sheet covering the second area is greater than 48 degrees.

3. The method of claim 1 , wherein

the sheet of resin contains at least one of acrylic resin, epoxy resin, silicone resin, and olefin resin.

4. The method of claim 1 further comprising:

cutting the sheet at a boundary between the first area and the second area, the cutting performed after the covering and before the separating, wherein

the first area and the second area are adjacent areas.

5. The method of claim 4 , wherein

the separating is performed by adhering a removal tape to the part of the sheet covering the second area and removing, away from the first substrate, the part of the sheet covering the second area along with the removal tape.

6. The method of claim 5 , wherein

the covering is performed by disposing, with respect to the first substrate, a laminate including the sheet and a separable layer, and thereby covering the first area and the second area with the sheet,

the cutting is performed by radiating a laser beam from outside the separable layer and cutting both the sheet and the separable layer at the boundary between the first area and the second area with the laser beam, and

the separating is performed by removing a part of the separable layer covering the second area, adhering the removal tape to extend over the part of the sheet covering the second area and a part of the separable layer covering the first area, and removing, away from the first substrate, the part of the sheet covering the second area and the part of the separable layer covering the first area along with the removal tape.

7. The method of claim 1 , wherein

an area of the second substrate facing the first area has a plurality of light-emission elements disposed therein.

8. The method of claim 7 , wherein

the first area has a plurality of color filter layers disposed therein.

9. The method of claim 7 , wherein

the second area surrounds the first area.