Optoelectronic semiconductor component with sapphire flip-chip
View Patent ↗An optoelectronic semiconductor component has a volume-emitting sapphire flip-chip with an upper side and a lower side. This optoelectronic semiconductor component is embedded in an optically transparent mold body with an upper side and a lower side.
1. A method for producing an optoelectronic semiconductor component, the method comprising:
providing a volume-emitting sapphire flip-chip with an upper side and a lower side;
embedding the chip in an optically transparent mold body with an upper side and a lower side;
arranging two solderable electrical connection surfaces on a lower side of the semiconductor component; and
after embedding the chip in the mold body, applying a reflective layer onto the lower side of the mold body.
2. The method as claimed in claim 1 , wherein the lower side of the chip is arranged on a film before the chip is embedded.
3. The method as claimed in claim 1 , further comprising after embedding the chip, removing a part of the mold body on the upper side of the mold body.
4. The method as claimed in claim 1 , wherein embedding the chip comprises embedding a plurality of sapphire flip-chips simultaneously in a common mold body.
5. The method as claimed in claim 4 , further comprising separating the common mold body after the chips are embedded.