IP Library Granted Patent US 9,634,051
Granted Patent B2
US 9,634,051 · App. 14/413,866 · Granted Apr 25, 2017

Optical devices, in particular computational cameras, and methods for manufacturing the same

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Quick Facts
Patent No.
US 9,634,051
App. No.
14/413,866
Granted
Apr 25, 2017
Kind
B2
Abstract

Then optical device comprises a first member (P) and a second member (O) and, arranged between said first and second members, a third member (S) referred to as spacer. The spacer (S) comprises —one or more portions referred to as distancing portions (Sd) in which the spacer has a vertical extension referred to as maximum vertical extension; —at least two separate portions referred to as open portions ( 4 ) in which no material of the spacer is present; and —one or more portions referred to as structured portions (Sb) in which material of the spacer is present and in which the spacer has a vertical extension smaller than said maximum vertical extension. Such optical devices can be used in or as multi-aperture cameras.

Claims (49)

1. A wafer stack comprising:

a wafer referred to as spacer wafer;

a wafer referred to as optics wafer, comprising a multitude of passive optical components; and

a wafer referred to as substrate wafer, wherein said spacer wafer is arranged between said optics wafer and said substrate wafer, and wherein the substrate wafer, the spacer wafer and the optics wafer are stacked along a vertical axis;

said spacer wafer comprising a multitude of portions referred to as spacer portions, each of said spacer portions being located in a different one of a multitude of first laterally defined regions along a lateral axis perpendicular to the vertical axis, each of said spacer portions comprising

one or more portions referred to as distancing portions, the spacer wafer having, in said one or more distancing portions, a vertical extension referred to as maximum vertical extension;

at least two separate portions referred to as open portions, the open portions being disposed along a lateral axis perpendicular to the vertical axis, no material of the spacer wafer being present in said open portions; and

one or more portions referred to as structured portions, wherein material of the spacer wafer is present in said structured portions, and the spacer wafer has, in said structured portion, a vertical extension smaller than said maximum vertical extension;

wherein said wafer stack comprises a multitude of portions referred to as device portions, each of said device portions

being located in one of a multitude of second laterally defined regions which are free from mutual overlap and that are disposed along a lateral axis perpendicular to the vertical axis;

comprising one of said multitude of spacer portions; and

comprising at least two of the passive optical components comprised in said optics wafer;

wherein in each of said device portions,

each of said at least two passive optical components extends vertically along a range referred to as vertical lens range, and

in said wafer stack, at least one of said structured portions extends into said vertical lens range.

2. The wafer stack according to claim 1 , wherein in each of said device portions

each of said at least two passive optical components comprises a main portion and a surrounding portion at least partially surrounding the respective main portion; and

said one or more structured portions are laterally overlapping with the respective surrounding portions.

3. The wafer stack according to claim 1 , wherein in each of said device portions said one or more structured portions are tapered toward said optics wafer.

4. The wafer stack according to claim 1 , wherein each of said at least two passive optical components comprises at least one lens or lens element.

5. The wafer stack according to claim 1 , wherein in each of said device portions, at least two of said at least two passive optical components extend into a respective one of the at least two open portions comprised in the respective device portion.

6. The wafer stack according to claim 1 , wherein each of said device portions comprises at least two active optical components comprised in said substrate wafer.

7. The wafer stack according to claim 6 , said wafer stack comprising, in each of said device portions, at least one of

a multi-aperture camera;

a computational camera;

a module for a multi-aperture camera;

a module for a computational camera.

8. The wafer stack according to claim 1 , wherein each of said open portions is laterally enclosed by one or more of said structured portions, or by one or more of said structured portions and at least one of said distancing portions.

9. An optical device comprising a first member and a second member and, arranged between said first and second members, a third member referred to as spacer, the first and second members and the spacer being stacked along a vertical axis, said spacer comprising

one or more portions referred to as distancing portions in which the spacer has a vertical extension referred to as maximum vertical extension;

at least two separate portions referred to as open portions in which no material of the spacer is present, the open portions being disposed along a lateral axis perpendicular to the vertical axis; and

one or more portions referred to as structured portions in which material of the spacer is present and in which the spacer has a vertical extension smaller than said maximum vertical extension,

wherein said first member comprises at least two passive optical components, each of said at least two passive optical components extending vertically along a range referred to as vertical lens range, at least one of said structured portions extending into said vertical lens range.

10. The optical device according to claim 9 , wherein each of said at least two passive optical components comprises a main portion and a surrounding portion at least partially surrounding the respective main portion, and said one or more structured portions are laterally overlapping with the respective surrounding portions.

11. The optical device according to claim 9 , wherein said one or more structured portions are tapered toward said first member.

12. The optical device according to claim 9 , wherein each of said open portions is located laterally within at least one of said distancing portions.

13. The optical device according to claim 9 , wherein said spacer is a unitary part fully or partially provided with a coating or devoid of a coating.

14. The optical device according to claim 9 , wherein the spacer is non-transparent, except in the open portions.

15. The optical device according to claim 9 , wherein outer bounds of a vertical silhouette of said first, second and third members each describe one and the same rectangular shape.

16. The optical device according to claim 9 , wherein each of said at least two passive optical components comprises at least one lens or lens element.

17. The optical device according to claim 9 , wherein said second member comprises at least two active optical components.

18. The optical device according to claim 9 , wherein said second member comprises at least two image sensors.

19. The optical device according to claim 9 , wherein the optical device comprises at least one of

a multi-aperture camera;

a computational camera;

a module for a multi-aperture camera;

a module for a computational camera.

20. The wafer stack according to claim 1 wherein each of the one or more structured portions is distanced from the optics wafer.

21. The optical device according to claim 9 wherein each of the one or more structured portions is distanced from the first member.

Assignments (4)
CHANGE OF NAME Recorded Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →
CHANGE OF NAME Recorded Feb 8, 2019
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 048289/0147 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2017
From: GUBSER, SIMON
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 041372/0555 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2015
From: HEIMGARTNER, STEPHAN; BIETSCH, ALEXANDER; RUDMANN, HARTMUT; ROSSI, MARKUS
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 035244/0078 →