Optoelectronic semiconductor component
View Patent ↗An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a first surface. The semiconductor chip is embedded in a mold body. The first surface is elevated with respect to a top side of the mold body. A reflective layer is arranged on the top side of the mold body.
1. A method of producing an optoelectronic semiconductor component comprising:
arranging a second surface of an optoelectronic semiconductor chip on a carrier;
impressing a first surface of the semiconductor chip into a first foil by a depth of 10 μm to 100 μm;
injecting a mold material between the first foil and the carrier to embed the semiconductor chip with a top side formed at a first foil in a mold body made of the mold material; and
arranging a reflective layer on the top side of the mold body.
2. The method according to claim 1 , wherein the first foil has a thickness of at least 150 μm.
3. The method according to claim 1 , wherein the reflective layer is formed of silicone filled with titanium dioxide arranged on the top side of the mold body.
4. The method according to claim 1 , wherein:
a sacrificial layer is arranged on the first surface of the semiconductor chip before the first surface is impressed into the first foil,
the reflective layer is deposited on the top side of the mold body and on the sacrificial layer, and
the sacrificial layer and the reflective layer deposited on the sacrificial layer are subsequently removed.
5. The method according to claim 1 , wherein a foil made of ethylene tetrafluoroethylene is the first foil.
6. The method according to claim 1 , wherein the first surface is formed by a surface of an epitaxy layer of the semiconductor chip.
7. The method according to claim 1 , wherein a plurality of optoelectronic semiconductor chips is arranged on the carrier.