Process for the manufacture of a multilayer silicone structure
A process for the manufacture of a multilayer silicone structure of cured silicone elastomer layers wherein the compositions of each of the curable silicone elastomers are chosen such as to provide excellent layer-to-layer adhesion of the said cured silicone elastomer layers, that is, the layers do not suffer from cohesive failure. The multilayer silicone structures may be used for example for the manufacture of electronic devices, coatings, shaped molded articles, laminates, etc.
1. A process for the manufacture of encapsulated or embedded electronic devices having a multilayer silicone structure, said multilayer silicone structure prepared by a process comprising the steps of:
a) applying a first curable silicone composition 1) to the surface of a first substrate, wherein said first silicone composition 1) comprises:
1-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule;
1-B) one or more oxidic fillers, optionally hydrophobized by reaction with one or more hydrophobing agents 1-C);
1-D) one or more a metal catalysts;
1-E) one or more polyorganosiloxanes having at least two SiH groups per molecule;
wherein
the molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) is from >1 to 4;
the molar ratio of the difference:
(molar amount of all SiH-groups in the composition 1) —molar amount of all alkenyl groups in the composition 1))
to
the molar amount of the oxidic filler 1-B) is <0.035;
b) curing said first curable silicone composition 1) on the surface of said first substrate;
c) applying a second curable silicone composition 2) to the surface of said first cured silicone composition 1), wherein said second curable silicone composition 2) comprises:
2-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule;
2-B) optionally one or more oxidic fillers, optionally hydrophobized by reaction with one or more hydrophobing agents 2-C);
2-D) one or more a metal catalysts;
2-E) one or more polyorganosiloxanes having at least two SiH groups per molecule;
wherein the molar ratio of all SiH groups in the composition 2) to all alkenyl groups in the composition 2) is from >1 to 10;
d) curing said second curable silicone composition 2),
to form encapsulated or embedded electronic devices having a multilayer silicone structure.
2. The process according to claim 1 , wherein said first curable silicone composition 1) and second curable silicone composition 2) are cured by irradiation and/or heat.
3. The process according to claim 1 , wherein said first curable silicone composition 1) is applied to said first substrate in an amount to provide a dry film thickness of 100 to 1000 μm.
4. The process according to claim 1 , wherein said second curable silicone composition 2) is applied to provide a wall thickness of the cured second layer of more than 1 mm.
5. The process according to claim 1 , wherein said first curable silicone composition 1) has a viscosity of 1 to 100 Pa·s (25° C. —shear rate D =10s −1 ) and wherein said second curable silicone composition 2) has a viscosity of 0.1 to 200 Pa·s (25° C. —shear rate D =10s −1 ).
6. The process according to claim 1 , wherein said first curable silicone composition 1) comprises, based on 100 parts per weight of component 1-A), 10 to 50 parts by weight of component 1-B).
7. The process according to claim 1 , wherein said first curable silicone composition 1) comprises 1-E) one or more polyorganosiloxanes having at least two SiH groups per molecule selected from the group of linear poly(hydrogenalkyl)siloxanes having more than 20 hydrogenalkylsiloxy groups, preferably more than 23 hydrogenalkylsiloxy groups.
8. The process according to claim 1 , wherein after the application of said first curable silicone composition 1) onto the first substrate one or more electrical components are applied on the surface of said first curable silicone composition 1), wherein said first curable silicone composition 1) is cured on the surface of said first substrate, and subsequently said second curable silicone composition 2) is applied thereby covering said one or more electrical components and said first curable silicone composition 1).
9. The process according to claim 1 , wherein said second curable silicone composition 2), before applying to the surface of said first silicone composition 1), is applied on a second substrate, and said second curable silicone composition 2) coated on the second substrate, is applied to the surface of said first silicone composition 1), and thereafter curing of said second curable silicone composition 2), is carried out, leading to a multilayer structure having two substrates bonded via the cured first and cured second silicone compositions 1) and 2) between said two substrates.
10. The process according to claim 1 , wherein said first silicone composition 1) and said second curable silicone composition 2) have the same or different composition.
11. The process according to claim 1 , wherein said first substrate is selected from semiconductors; plastic, metal, ceramic, and glass.
12. The process according to claim 1 , wherein said multi-layer silicone structure is used for the manufacture of encapsulated or embedded solar cell modules, encapsulated or embedded integrated circuits; electrical insulators, encapsulated or embedded LEDs, and intermediate layers of displays, monitors or screens.
13. The process according to claim 1 , for the manufacture of encapsulated or embedded electronic devices having a multilayer silicone structure wherein the encapsulated or embedded electronic devices having a multilayer silicone structure is a photovoltaic device, said process is selected from:
(A) a process which comprises the steps of:
(a) providing a substrate,
(b) applying said first curable silicone composition 1) to the surface of the substrate,
(c) providing at least one solar cell onto said first curable silicone composition 1),
(d) curing said first curable silicone composition 1),
(e) applying said second curable silicone composition 2) to the surface of the layer formed of the first cured silicone composition 1) and to the surface of the solar cells if not yet covered completely,
(f) optionally applying a back skin substrate to the surface of the structure obtained in step (e),
(g) curing said second curable silicone composition 2); or
(B) a process which comprises the steps of:
(a) providing a substrate,
(b) applying said first curable silicone composition 1) to the surface of the substrate,
(c) providing at least one solar cell onto said first curable silicone composition 1),
(d) curing said first curable silicone composition 1),
(e) applying said second curable silicone composition 2) to the surface of a back skin substrate;
(f) applying said back skin substrate with the layer of the second curable silicone composition 2) to the surface of the layer of the first curable silicone composition 1) to bring the first and second layers of the curable silicone compositions into contact with each other,
(g) curing said second curable silicone composition 2); or
(C) a process which comprises the steps of:
(a) providing solar cells,
(b) applying said first curable silicone composition 1) onto the solar cells,
(c) providing a substrate on the surface of the layer of said first curable silicone composition 1),
(d) curing said first curable silicone composition 1),
(e) applying a second curable silicone composition 2) onto the surface of the layer of the first silicone composition 1),
(f) optionally applying a back skin substrate onto the layer of said second curable silicone composition 2),
(g) curing said second curable silicone composition 2) wherein said first silicone composition 1) comprises:
1-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule;
1-B) one or more oxidic fillers, optionally hydrophobized by reaction with one or more hydrophobing agents 1-C);
1-D) one or more a metal catalysts;
1-E) one or more polyorganosiloxanes having at least two SiH groups per molecule;
wherein
the molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) is from >1 to 4;
the molar ratio of the difference:
(molar amount of all SiH-groups in the composition 1) —molar amount of all
alkenyl groups in the composition 1))
to
the molar amount of the oxidic filler 1-B) is <0.035; and
wherein said second curable silicone composition 2) comprises:
2-A) one or more polyorganosiloxanes having at least two alkenyl groups per molecule;
2-B) optionally one or more oxidic fillers, optionally hydrophobized by reaction with one or more hydrophobing agents 2-C);
2-D) one or more a metal catalysts;
2-E) one or more polyorganosiloxanes having at least two SiH groups per molecule;
wherein the molar ratio of all SiH groups in the composition 2) to all alkenyl groups in the composition 2) is from >1 to 10.
14. The process of claim 1 , wherein in step (a), the polyorganosiloxanes 1-E) having at least two SiH groups per molecule have (i) a molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) of from >1 to 2.5.
15. The process of claim 1 , wherein in step (a), the polyorganosiloxanes 1-E) having at least two SiH groups per molecule have (i) a molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) of from >1 to 2.
16. The process of claim 15 , wherein in step (a), the polyorganosiloxanes 1-E) having at least two SiH groups per molecule have (i) a molar ratio of all SiH groups in the composition 1) to all alkenyl groups in the composition 1) of from >1 to 2.
17. The process of claim 16 , wherein in step (c) the polyorganosiloxanes 2-E) having at least two SiH groups per molecule have a molar ratio of all SiH groups in the composition 2) to all alkenyl groups in the composition 2) of from 1.05 to 10.
18. The process of claim 1 , wherein in step (c) the polyorganosiloxanes 2-E) having at least two SiH groups per molecule have a molar ratio of all SiH groups in the composition 2) to all alkenyl groups in the composition 2) of from 1.05 to 10.