Strengthened LED package and method therefor
View Patent ↗Crimping of an LED leadframe to a subassembly may stress the leadframe. Flat leadframes cannot accommodate these stresses. Strain relief sections are added to the leadframe to accommodate crimping or other stresses on the leadframe. Strain relief sections are created in the leadframe in the form of openings, notches or bulges. The strain relief sections may be symmetric or asymmetric.
1. An apparatus comprising:
an electronic component; and
a leadframe comprising at least one leadframe member connected to the electronic component, the at least one leadframe member having an upper surface, a lower surface opposite the upper surface, and at least one bulge indented into the lower surface and extending above a plane of the upper surface, the bulge having an upper section in which a thickness between the upper surface and lower surface of the leadframe member is smaller than a thickness between the upper surface and lower surface of the leadframe member outside of the bulge; and
a subassembly facing the lower surface of the at least one leadframe member and connected to the at least one leadframe member at a clinching position, the bulge positioned between and spaced apart from the electronic component and the clinching position.
2. The apparatus of claim 1 wherein the electronic component is an LED.
3. The apparatus of claim 1 wherein the at least one leadframe member is connected to a bottom surface of the electronic component.
4. The apparatus of claim 1 wherein the at least one leadframe member is connected to at least one side surface of the electronic component.
5. The apparatus of claim 1 further comprising at least two leadframe members, the at least two leadframe members being connected to different side surfaces of the electronic component.
6. The apparatus of claim 1 , wherein the at least one leadframe member does not have a bend.