Ink formulations for flexographic printing of high-resolution conducting patterns
View Patent ↗Systems and methods disclosed herein are directed towards flexographic printing of microscopic high resolution conductive patterns (HRCP). These HRCP may be printed using one or more formulations for high polarity and stable viscosity inks for use in the flexographic printing process. The inks may be water permeable, UV curable, and configured to resist loss of integrity when exposed to water and atmospheric moisture.
1. A method of flexographically manufacturing a high resolution conductive pattern comprising:
flexographically printing a first pattern on a substrate using an ink, wherein the first pattern includes a plurality of lines, and wherein each line of the plurality of lines is between 1 micron-25 microns wide;
wherein the ink includes:
a water-compatible polymer including Polyethylene glycol diacrylate;
a plating catalyst;
a photoinitiator including thioxanthen-9-one; and
a plurality of nano-fibers;
curing the first pattern, by least partially solidifying the printed pattern; and
plating the first pattern to form a conductive pattern.
2. The method of claim 1 , wherein the plating catalyst includes at least one of palladium acetate, palladium 2,4-pentanedionate, silver (Ag), platinum (Pt), gold (Au), and erbium (Er).
3. The method of claim 1 , wherein the plating catalyst includes a plurality of nanoparticles, wherein each nanoparticle has a size between 10 nm-5 microns.
4. The method of claim 1 , wherein each nano-fiber of the plurality of nano-fibers has a diameter of 20 nm to 200 nm, and a length of 2 micron to 10 microns.
5. A method of flexographically manufacturing a high resolution conductive pattern comprising:
flexographically printing a first pattern on a substrate using an ink, wherein the first pattern includes a plurality of lines, and wherein each line of the plurality of lines is between 1 micron-25 microns wide;
wherein the ink includes:
a water-compatible polymer;
a plating catalyst;
curing the first pattern, by least partially solidifying the printed pattern; and
plating the first pattern to form a conductive pattern;
wherein the ink includes Bisphenol A diacrylate from 5 wt. %-80 wt. %, Polyethylene glycol diacrylate from 10 wt. %-80 wt. %, Hydroxyethyl methacrylate from 5 wt. %-50 wt. %, Pentaerythritol tetraacrylate from 5 wt. %-50 wt. %, 1 -Hydroxy-cyclohexyl-phenyl-ketone 1 wt.%-10 wt. %, 2,2 -Dimethyl-1,2-diphenylethan-1-one 1 wt. %-10 wt. %, and Palladium acetate 0.1 wt. %-20 wt. %.
6. The method of claim 1 , wherein the first pattern is printed on a first side of the substrate and the method further includes printing a second pattern using the ink on at least one of the substrate on a side opposite the first side, adjacent to the first pattern on the first side of the substrate, or on a different substrate.
7. The method of claim 1 , wherein plating includes electroless plating using at least one of copper (Cu), nickel (Ni), tin (Sn), gold (Au), silver (Ag), and erbium (Er).