IP Library Granted Patent US 9,719,824
Granted Patent B2
US 9,719,824 · App. 14/418,330 · Granted Aug 1, 2017

Thermal air flow sensor

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Quick Facts
Patent No.
US 9,719,824
App. No.
14/418,330
Granted
Aug 1, 2017
Kind
B2
Abstract

A thermal air flow sensor that offers high flow rate measurement accuracy is provided. The thermal air flow sensor includes a measuring element. The measuring element includes: a semiconductor substrate; a heating resistor and a temperature measuring resistor both formed as a result of thin films being stacked over the semiconductor substrate; an electronic insulator including a silicon oxide film; and a diaphragm portion formed after part of the semiconductor substrate is removed. The heating resistor and the temperature measuring resistor are formed over the diaphragm portion. In the thermal air flow sensor, a ratio of an area occupied by the thin films to an area of the measuring element ranges between 40% and 60%.

Claims (13)

1. A thermal air flow sensor including a measuring element, the measuring element comprising:

a semiconductor substrate;

a heating resistor and a temperature measuring resistor both formed as a result of thin films being stacked over the semiconductor substrate;

an electronic insulator including a silicon oxide film;

a diaphragm portion formed after part of the semiconductor substrate is removed; and

a thin film formed of a material identical to a material used for the temperature measuring resistor, wherein

the heating resistor and the temperature measuring resistor are formed over the diaphragm portion,

the thin film occupies an area relative to the area of the measuring element at a ratio ranging between 40% and 60%, and

the thin film formed of the material identical to the material used for the temperature measuring resistor are not electrically connected to other portions.

2. The thermal air flow sensor according to claim 1 , wherein the thin film formed of the material identical to the material used for the temperature measuring resistor is arrayed in a zigzag pattern.

3. The thermal air flow sensor according to claim 2 , wherein the thin film arrayed in the zigzag pattern has a rectangular shape.

4. The thermal air flow sensor according to claim 2 , wherein the thin film arrayed in the zigzag pattern has a quadrilateral or circular shape.

5. The thermal air flow sensor according to claim 1 , wherein the thin film formed of the material identical to the material used for the temperature measuring resistor is disposed on the semiconductor substrate outside the diaphragm portion.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2015
From: ISHITSUKA, NORIO; ONOSE, YASUO; SAKUMA, NORIYUKI; NAKANO, HIROSHI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 034853/0157 →