Device for decoupling antennas mounted on an aircraft
A high-impedance passive device to radio-electrically decouple two antennas operating at least partially within a common frequency band and arranged on a surface of the carrier structure. A substrate of the device has a flexible dielectric material layer having a predetermined thickness with patches of conductive material arranged on its surface and a layer to attach the device onto the surface of the carrier structure. The patches having predetermined shape and arrangement. The body of the substrate separates the dielectric layer from the surface of the carrier structure. The substrate thickness is determined based on the size, number, and arrangement of the patches, and further it is based on the aerodynamic constraints imposed on the device. The device having an impedance to cause the desired decoupling in the common frequency band.
1. A high-impedance passive device to provide a given radio-electric decoupling between two separated antennas operating at least partially in a common frequency band and already arranged on a surface of a carrier structure, comprising a substrate comprising a flexible dielectric material layer of a predetermined thickness with patches disposed on a surface of the flexible dielectric material layer, the patches being made of conducting material exhibiting a predetermined geometry and a predetermined arrangement; and an attachment layer to fix the high-impedance passive device on a ground plane on the surface of the carrier structure such that the flexible dielectric material layer formed by the patches is separated from the surface of the carrier structure by a substrate thickness, which is determined as a function of the predetermined geometry, a number and the predetermined arrangement of the patches, and aerodynamic constraints imposed on the high-impedance passive device exhibiting an impedance to produce the given decoupling in the common frequency band.
2. The device as claimed in claim 1 , wherein the dielectric material of the substrate is a flexible material of elastomer type configured to fit a shape of the surface of the carrier structure on which the high-impedance passive device is mounted.
3. The device as claimed in claim 2 , wherein the dielectric material is polychloroprene.
4. The device as claimed in claim 1 , wherein the ground plane on which the high-impedance passive device is fixed comprises the carrier structure.
5. The device as claimed in claim 1 , wherein the ground plane on which the high-impedance passive device is fixed comprises a sheet of conducting material having a predetermined thickness and placed on a face of the high-impedance passive device in contact with the surface of the carrier structure.
6. The device as claimed in claim 5 , wherein the patches are electrically linked to the sheet of conducting material by conductors or vias.
7. The device as claimed in claim 1 , wherein the attachment layer comprises an adhesive material layer disposed on a face of the high-impedance passive device in contact with the surface of the carrier structure.
8. The device as claimed in claim 1 , wherein the substrate covers a plane of the patches to ensure mechanical protection of a free surface of the high-impedance passive device.
9. The device as claimed in claim 1 , wherein an external surface of the high-impedance passive device is covered with a purely dielectric coating.
10. The device as claimed in claim 1 , wherein a thickness of the high-impedance passive device is substantially identical to a thickness of the two separated antennas between which the high-impedance passive device is placed.