Method for producing an optoelectronic component and method for patterning an organic, optoelectronic component

1. A method for producing an organic optoelectronic component, the method comprising:

forming a first layer on a substrate, the first layer comprising a substance or a substance mixture, wherein the first layer is in a physical contact with the substrate, the substrate comprising at least one contact pad of the organic optoelectronic component, at least one electrode of the organic optoelectronic component being electrically connected to the at least one contact pad;

forming a second layer on or over the substrate, the second layer comprising a substance or a substance mixture, wherein the second layer is in at least one region of the substrate in a physical contact with the first layer; and

removing at least the second layer in at least one region of the substrate with the first layer and the contact pad;

wherein the substance or of the substance mixture of the first layer has a lesser adhesion to the substrate than the substance or of the substance mixture of the second layer has to the substrate.

2. The method as claimed in claim 1 ,

wherein the adhesion of the first layer with the substrate being lower than the adhesion of the substance or of the substance mixture of the second layer on the interface with the substrate is formed by a process.

3. The method as claimed in claim 2 ,

wherein the process comprises at least one process step from the group of process steps:

separating regions of the first layer and/or second layer;

bombardment of the first layer and/or second layer with electrons, ions, photons or the like;

a wet chemical process, a dry chemical process, chemical-mechanical polishing, etching or the like.

4. The method as claimed in claim 1 ,

wherein the lower adhesion of the first layer is formed before or after the removal of the second layer.

5. The method as claimed in claim 1 ,

wherein the second layer is removed in the at least one region by removing the first layer in the at least one region.

6. The method as claimed in claim 1 ,

wherein the first layer is resistant during the removal of the second layer.

7. The method as claimed in claim 1 ,

wherein a part of the first layer is removed during the removal of the second layer.

8. The method as claimed in claim 1 ,

wherein the removal of the second layer comprises at least one process from the group of processes:

ballistic removal;

mechanical removal; and/or

chemical removal.

9. The method as claimed in claim 1 ,

wherein the second layer is configured as an encapsulation layer of the optoelectronic component.

10. The method as claimed in claim 1 ,

configured for the exposure of at least one contact pad of an optoelectronic component.

11. A method for patterning an organic optoelectronic component, the method comprising:

forming a first layer on an organic functional layer structure of the organic optoelectronic component, the first layer comprising a substance or a substance mixture wherein the first layer is in a physical contact with the organic functional layer structure;

forming a second layer on or over the organic functional layer structure, the second layer comprising a substance or a substance mixture, wherein the second layer is in a physical contact with the first layer; and

removing at least the second layer in at least one region with the first layer on or over the organic functional layer structure;

wherein the substance or of the substance mixture of the first layer has a lesser adhesion to the organic functional layer structure the substance or of the substance mixture of the second layer to the organic functional layer structure.

12. The method as claimed in claim 11 ,

configured for lateral patterning of the surface of an optoelectronic component.

13. The method as claimed in claim 11 ,

configured for lateral patterning of the surface of an organic light-emitting diode.