Optoelectronic component and method of producing an optoelectronic component
An optoelectronic component including a housing having at least one first cutout and at least one first semiconductor chip arranged in the first cutout, wherein the first cutout is a first reflector that reflects radiation generated during operation of the first semiconductor chip, the first reflector has a surface, and the surface has a targeted setting of an emission characteristic of the radiation emitted by the first semiconductor chip during operation.
1. An optoelectronic component comprising:
a housing having at least one first cutout,
at least one first semiconductor chip arranged in the first cutout, wherein:
the first cutout is a first reflector that reflects radiation generated during operation of the first semiconductor chip,
the first reflector has a surface with a targeted setting of an emission characteristic of the radiation emitted by the first semiconductor chip during operation,
the housing has at least one second cutout which is a second reflector,
a second semiconductor chip is arranged in the second cutout,
the first reflector diffusely reflects the radiation emitted by the first semiconductor chip, and
the second reflector directionally reflects the radiation emitted by the second semiconductor chip.
2. The optoelectronic component according to claim 1 , wherein the surface roughness of the first reflector is greater than the surface roughness of the second reflector and/or the respective surface of the first and second reflectors at least partly have a metallic layer, and the metallic layer of the first reflector is thinner than the metallic layer of the second reflector.
3. The optoelectronic component according to claim 1 , wherein the surface roughness of the first reflector is greater than the surface roughness of the second reflector.
4. The optoelectronic component according to claim 3 , wherein the surface roughness of the first reflector is greater than or equal to the wavelength of the radiation emitted by the first semiconductor chip, and the surface roughness of the second reflector is less than the wavelength of the radiation emitted by the second semiconductor chip.
5. The optoelectronic component according to claim 1 , wherein the housing is formed from a plastic.
6. A method of producing the optoelectronic component according to claim 1 , comprising:
providing the housing, which is formed from a plastic, the at least one cutout being formed in the housing, and the cutout having a surface;
providing the at least one semiconductor chip;
electrodepositing or electroless depositing the metallic layer at least in a region of the surface of the cutout to form a reflective surface and for the targeted setting of the emission characteristic of the radiation emitted by the component during the operation; and
arranging the semiconductor chip in the cutout, wherein the housing has at least one second cutout which is a second reflector, a second semiconductor chip is arranged in the second cutout, the first reflector diffusely reflects the radiation emitted by the first semiconductor chip, and the second reflector directionally reflects the radiation emitted by the second semiconductor chip.
7. The method according to claim 6 , wherein the surface roughness of the first reflector is greater than the surface roughness of the second reflector and/or the respective surface of the first and second reflectors at least partly have a metallic layer, and the metallic layer of the first reflector is thinner than the metallic layer of the second reflector.
8. A method of producing an optoelectronic component according to claim 1 , comprising:
providing the housing which is formed from a plastic by an injection molding method, wherein the at least one cutout is formed in the housing, the cutout has a surface, and, before injection molding the housing, at least one region of a surface of an injection mold is polished for the targeted setting of the emission characteristic of the radiation emitted by the component during operation;
providing the at least one semiconductor chip;
applying the metallic layer by sputtering or thermal vapor deposition at least in a region of the surface of the cutout to form a reflective surface; and
arranging the semiconductor chip in the cutout.
9. The method according to claim 8 , wherein the surface is smoother in the second region than in the first region as a result of the surface of the injection mold being polished, and/or wherein the surface is smoother in the at least one reflector than in at least one further reflector as a result of the surface of the injection mold being polished.
10. An optoelectronic component comprising a housing having at least one first cutout and at least one first semiconductor chip arranged in the first cutout, wherein the first cutout is a first reflector that reflects radiation generated during operation of the first semiconductor chip, the first reflector has a surface, and the surface has a targeted setting of an emission characteristic of the radiation emitted by the first semiconductor chip during operation, wherein the surface of the first reflector has at least one first and at least one second region, wherein the first region of the surface of the first reflector has a higher surface roughness than the second region of the surface of the first reflector.
11. The optoelectronic component according to claim 10 , wherein the first region of the surface of the first reflector diffusely reflects the radiation emitted by the first semiconductor chip, and the second region of the surface of the first reflector reflects the radiation emitted by the first semiconductor chip more directionally than the first region.
12. The optoelectronic component according to claim 10 , wherein the surface roughness of the first region is greater than or equal to the wavelength of the radiation emitted by the first semiconductor chip, and the surface roughness of the second region is less than the wavelength of the radiation emitted by the first semiconductor chip.
13. The optoelectronic component according to claim 10 , wherein the surface of the first reflector has at least partly a metallic layer, and the metallic layer in the second region is thicker than the metallic layer in the first region.
14. A method of producing an optoelectronic component according to claim 10 , comprising:
providing the housing which is formed from a plastic by an injection molding method, wherein the at least one cutout is formed in the housing, the cutout has a surface, and, before injection molding the housing, at least one region of a surface of an injection mold is polished for the targeted setting of the emission characteristic of the radiation emitted by the component during operation;
providing the at least one semiconductor chip;
applying the metallic layer by sputtering or thermal vapor deposition at least in a region of the surface of the cutout to form a reflective surface; and
arranging the semiconductor chip in the cutout.
15. The method according to claim 14 , wherein the surface is smoother in the second region than in the first region as a result of the surface of the injection mold being polished, and/or wherein the surface is smoother in the at least one reflector than in at least one further reflector as a result of the surface of the injection mold being polished.
16. An optoelectronic component comprising a housing having at least one first cutout, at least one first semiconductor chip arranged in the first cutout, the first cutout is a first reflector that reflects radiation generated during operation of the first semiconductor chip, the first reflector has a surface with a targeted setting of an emission characteristic of the radiation emitted by the first semiconductor chip during operation, the housing has at least one second cutout which is a second reflector, a second semiconductor chip is arranged in the second cutout, and the surface roughness of the first reflector is greater than the surface roughness of the second reflector.
17. The optoelectronic component according to claim 16 , wherein the respective surface of the first and second reflectors at least partly have a metallic layer, and the metallic layer of the first reflector is thinner than the metallic layer of the second reflector.
18. A method of producing the optoelectronic component according to claim 16 , comprising:
providing the housing, which is formed from a plastic, the at least one cutout being formed in the housing, and the cutout having a surface;
providing the at least one semiconductor chip;
electrodepositing or electroless depositing the metallic layer at least in a region of the surface of the cutout to form a reflective surface and for the targeted setting of the emission characteristic of the radiation emitted by the component during the operation; and
arranging the semiconductor chip in the cutout, wherein the housing has at least one second cutout which is a second reflector, a second semiconductor chip is arranged in the second cutout, the first reflector diffusely reflects the radiation emitted by the first semiconductor chip, and the second reflector directionally reflects the radiation emitted by the second semiconductor chip.
19. The method according to claim 18 , wherein the surface roughness of the first reflector is greater than the surface roughness of the second reflector and/or the respective surface of the first and second reflectors at least partly have a metallic layer, and the metallic layer of the first reflector is thinner than the metallic layer of the second reflector.
20. A method of producing an optoelectronic component according to claim 16 , comprising:
providing the housing which is formed from a plastic by an injection molding method, wherein the at least one cutout is formed in the housing, the cutout has a surface, and, before injection molding the housing, at least one region of a surface of an injection mold is polished for the targeted setting of the emission characteristic of the radiation emitted by the component during operation;
providing the at least one semiconductor chip;
applying the metallic layer by sputtering or thermal vapor deposition at least in a region of the surface of the cutout to form a reflective surface; and
arranging the semiconductor chip in the cutout.
21. The method according to claim 20 , wherein the surface is smoother in the second region than in the first region as a result of the surface of the injection mold being polished, and/or wherein the surface is smoother in the at least one reflector than in at least one further reflector as a result of the surface of the injection mold being polished.